DocumentCode
956497
Title
Thin-Film Hybrids - A Practical Approach to Integrated Circuitry
Author
Saunders, Ralph
Author_Institution
Burroughs Corp.
Volume
1
Issue
1
fYear
1965
fDate
6/1/1965 12:00:00 AM
Firstpage
63
Lastpage
69
Abstract
Thin-film hybrid circuits are described, and it is shown how, and why they are especially applicable, both practically and economically, in applications where space, weight, power, and operating speed are important considerations.
Keywords
Anodizing; Cathodic sputtering; Ceramic-wafer capacitor; Deposited circuits; Discrete components; Fabrication; Hybrid circuits; IC (Integrated circuits); Integrated circuits; Microelectronics; Miniaturization; Molecular circuits; Photoetching; Resistor/conductor networks; Substrates; Thin films; Thin-film hybrid; Capacitors; Conductive films; Costs; Electronics industry; Integrated circuit noise; Power generation economics; Resistors; Sputtering; Substrates; Thin film circuits;
fLanguage
English
Journal_Title
Parts, Materials and Packaging, IEEE Transactions on
Publisher
ieee
ISSN
0018-9502
Type
jour
DOI
10.1109/TPMP.1965.1135344
Filename
1135344
Link To Document