Adhesion of Platinum-Gold Glaze Conductors

The present work studies the time-temperature relationships of adhesion for typical platinum-gold glaze conductors. An empirical equation is derived from which it is possible to calculate the optimum time and temperature of firing. It is shown that the effects of two firings must be taken into account in choosing primary firing conditions. Adhesion was studied as a function of time at elevated temperature, as a function of elevated temperature and humidity and as a function of temperature cycling. Adhesion is degraded by high ambient temperature and humidity through continued reaction with eutectic solder, but life is estimated at 1,000 hours even at 150°C. Conductor films appear insensitive to thermal shock.