A Discrete Tantalum Nitride Thin Film Resistor on a Flat Embossed Ceramic Substrate

A newly developed tantalum nitride thin film resistor is being evaluated that uses an unglazed flat ceramic substrate with a pattern for the resistive element embossed into its surface. The resistive element is the sputtered tantalum nitride film with its inherent low temperature coefficient of resistance and high stability over long term load life. The design is such that it eliminates the use of photolithographic techniques and electrolytic processing. Preliminary tests indicate that this resistor design offers a high degree of reliability and stability.