• DocumentCode
    956771
  • Title

    A novel laser direct write technique for fabrication of thin film MICs

  • Author

    Harish, C.M. ; Kumar, V. ; Prabhakar, A.

  • Author_Institution
    Indian Telephone Ind. Ltd., Bangalore, India
  • Volume
    6
  • Issue
    3
  • fYear
    1993
  • fDate
    8/1/1993 12:00:00 AM
  • Firstpage
    279
  • Lastpage
    282
  • Abstract
    A technique for fabrication of thin-film circuits for microwave integrated circuit (MIC) application is presented. This low-cost fabrication technique utilizes laser direct write of copper patterns on alumina substrates. The method obviates the need for photomasks and photolithography. The film deposition mechanism, deposit film analysis, and MIC fabrication sequence are presented. Performance evaluation of MICs fabricated using this technique is also included
  • Keywords
    integrated circuit technology; laser beam applications; microwave integrated circuits; thin film circuits; Al2O3; Cu-Al2O3; copper patterns; deposit film analysis; fabrication sequence; laser direct write technique; thin film MICs; Application specific integrated circuits; Copper; Lithography; Masers; Microwave integrated circuits; Microwave theory and techniques; Optical device fabrication; Substrates; Thin film circuits; Transistors;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.238180
  • Filename
    238180
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=956771