Title :
A novel laser direct write technique for fabrication of thin film MICs
Author :
Harish, C.M. ; Kumar, V. ; Prabhakar, A.
Author_Institution :
Indian Telephone Ind. Ltd., Bangalore, India
fDate :
8/1/1993 12:00:00 AM
Abstract :
A technique for fabrication of thin-film circuits for microwave integrated circuit (MIC) application is presented. This low-cost fabrication technique utilizes laser direct write of copper patterns on alumina substrates. The method obviates the need for photomasks and photolithography. The film deposition mechanism, deposit film analysis, and MIC fabrication sequence are presented. Performance evaluation of MICs fabricated using this technique is also included
Keywords :
integrated circuit technology; laser beam applications; microwave integrated circuits; thin film circuits; Al2O3; Cu-Al2O3; copper patterns; deposit film analysis; fabrication sequence; laser direct write technique; thin film MICs; Application specific integrated circuits; Copper; Lithography; Masers; Microwave integrated circuits; Microwave theory and techniques; Optical device fabrication; Substrates; Thin film circuits; Transistors;
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
