• DocumentCode
    956777
  • Title

    The Leakage Current of the Schottky Contact on the Mesa Edge of AlGaN/GaN Heterostructure

  • Author

    Xu, Chuan ; Wang, Jinyan ; Chen, Hongwei ; Xu, Fujun ; Dong, Zhihua ; Hao, Yilong ; Wen, Cheng P.

  • Author_Institution
    Peking Univ., Beijing
  • Volume
    28
  • Issue
    11
  • fYear
    2007
  • Firstpage
    942
  • Lastpage
    944
  • Abstract
    A test structure, which is called the ridge-furrow structure, is used to evaluate the leakage current of the Schottky contact on the mesa edge of an AlGaN/GaN heterostructure. The mesa edge leakage currents were measured at different temperatures from 300 to 500 K and analyzed. The conduction-band-edge energy distribution at the mesa edge is simulated by the Integrated Systems Engineering Technology Computer-Aided Design. Based on the simulation results, the electric field strength can be obtained as a function of reverse bias voltage. The mesa edge leakage current is found to agree with the predicted characteristics, which is based on the Frenkel-Poole emission model. Therefore, we believe that the Frenkel-Poole emission dominates the mesa edge leakage at temperatures between 300 and 500 K.
  • Keywords
    CAD; III-V semiconductors; Poole-Frenkel effect; Schottky barriers; aluminium compounds; gallium compounds; high electron mobility transistors; leakage currents; AlGaN-GaN - Interface; Frenkel-Poole emission model; Schottky contact; computer-aided design; conduction-band-edge energy distribution; heterostructure field effect transistor; integrated systems engineering technology; leakage current; mesa edge; reverse bias voltage; ridge-furrow structure; temperature 300 K to 500 K; Aluminum gallium nitride; Computational modeling; Computer simulation; Current measurement; Design engineering; Gallium nitride; Leakage current; Schottky barriers; Temperature measurement; Testing; AlGaN/GaN; Frenkel–Poole; characteristic electric field strength; leakage current; mesa edge; ridge-furrow structure;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2007.906932
  • Filename
    4367578