Title :
The Use of Adhesives and Sealants in Electronics
Author_Institution :
Sandia Corporation, Sandia Base,Albuquerque, N.Mex
fDate :
12/1/1965 12:00:00 AM
Abstract :
This paper surveys the wide variety of resin compounds available to meet the demands of modern electronics. It describes the properties and characteristics relevant to choosing a compound for a required performance and reliability and presents some guides for selection and use. Experimental data supports the discussion and comparison of resin properties.
Keywords :
Adhesives; Elastomers; Epoxies; Polysulphides; Polyurethanes; Resins; Sealants; Silicones; Synthetics; Bonding; Curing; Epoxy resins; Gases; Moisture; Rubber; Sealing materials; Solvents; Temperature dependence; Temperature sensors;
Journal_Title :
Parts, Materials and Packaging, IEEE Transactions on
DOI :
10.1109/TPMP.1965.1135404
