DocumentCode
957487
Title
A Low-Cost Thin-Film Microcircuit Process
Author
Kerns, David V. ; Kull, Julius M. ; Ruwe, Victor W.
Author_Institution
Auburn Univ.,AL
Volume
2
Issue
2
fYear
1979
fDate
6/1/1979 12:00:00 AM
Firstpage
218
Lastpage
221
Abstract
A low-cost thin-film microcircuit conductor/resistor technology is developed which offers reduced material costs, a simple fabrication process, relatively low resistor temperature coefficients, and low resistance conductor metalization. The process uses copper for the conductors and Kanthal for the resistors; the process is compatible with certain selective etches to realize a subtractive process.
Keywords
Integrated circuit economics; Thin-film circuit interconnections; Thin-film resistors; Conducting materials; Conductive films; Copper; Costs; Etching; Fabrication; Inorganic materials; Resistors; Temperature; Transistors;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1979.1135445
Filename
1135445
Link To Document