Bumped Tape Automated Bonding (BTAB) Practical Application Guidelines

A number of mass bonding techniques have been used to replace wire bonding in hybrid microcircuit (HM) fabrication, but none has approached universal acceptance. In recent years tape carrier technology, typically called tape automated bonding (TAB) has received considerable attention. A more recent development, bumped tape automated bonding (BTAB), maintains the advantages of conventional TAB, offers some unique features of its own, and can be quite compatible with conventional aluminum-metallized integrated circuit (lC) chips. The present status of BTAB technology from the standpoint of practical HM fabrication and performance is presented.