Magnetic bubble dual-in-line package (DIP) functional and reliability testing

Computer tested magnetic bubble chips have been assembled into dual-in-line packages (DIPs). In order to insure that stringent telephone station apparatus specifications are met, many packages have been subjected to extensive functional and environmental tests. From the functional tests average values and standard deviations of operating parameters at minimum rotating field over the temperature range of -25°C to +50°C have been determined. Environmental tests included temperature cycling (-40°C to +65°C), thermal shock, high temperature at high humidity (85% humidity/85°C), and mechanical shock and vibration. Of the 74 packages subjected to all environmental tests, 48 (or 64.9%) passed. Data indicate the package design to be good in terms of meeting operational, shock and vibration requirements; however, improvements in bond reliability are indicated.