• DocumentCode
    960369
  • Title

    Electroosmotic pumps fabricated from porous silicon membranes

  • Author

    Yao, Shuhuai ; Myers, Alan M. ; Posner, Jonathan D. ; Rose, Klint A. ; Santiago, Juan G.

  • Author_Institution
    Dept. of Mech. Eng., Stanford Univ., CA, USA
  • Volume
    15
  • Issue
    3
  • fYear
    2006
  • fDate
    6/1/2006 12:00:00 AM
  • Firstpage
    717
  • Lastpage
    728
  • Abstract
    N-type porous silicon can be used to realize electroosmotic pumps with high flow rates per applied potential difference. The porosity and pore size of porous silicon membranes can be tuned, the pore geometry has near-unity tortuosity, and membranes can be made thin and with integrated support structures. The size of hexagonally packed pores is modified by low-pressure chemical vapor deposition (LPCVD) polysilicon deposition, followed by wet oxidation of the polysilicon layer, resulting in a pore radius varying from 1 to 3 μm. Pumping performance of these devices is experimentally studied as a function of pore size and compared with theory. These 350-μm-thick silicon membranes exhibit a maximum flow rate per applied field of 0.13 ml/min/cm2/V. This figure of merit is five times larger than previously demonstrated porous glass EO pumps.
  • Keywords
    chemical vapour deposition; electrophoresis; elemental semiconductors; microfluidics; micropumps; porous semiconductors; silicon; 1 to 3 micron; 350 micron; N-type porous silicon; electroosmotic pumps; hexagonally packed pores; low-pressure chemical vapor deposition; polysilicon deposition; polysilicon layer; pore geometry; pore size; porosity; porous silicon membranes; wet oxidation; Biomembranes; Chemical vapor deposition; Geometry; Glass; Mechanical engineering; Oxidation; Permittivity; Pump lasers; Silicon; Voltage; Electroosmotic pump; porous silicon membrane; zeta potential;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2006.876796
  • Filename
    1638499