• DocumentCode
    960443
  • Title

    Ultralow on-resistance p-channel lateral DMOS fabricated on (110)-oriented Si substrate

  • Author

    Throngnumchai, Kraisorn

  • Author_Institution
    Nissan Motor Co. Ltd., Kanagawa
  • Volume
    40
  • Issue
    11
  • fYear
    1993
  • fDate
    11/1/1993 12:00:00 AM
  • Firstpage
    2132
  • Lastpage
    2133
  • Abstract
    Summary form only given. A p-channel lateral DMOS (LDMOS) featuring improved on-resistance through the use of a (110)-oriented Si substrate is presented. The authors fabricated p-channel LDMOS on both (100) and (110) substrates and compared their on-resistance. The on-resistance of the samples was determined as a function of their effective longitudinal gate field, Einv. The measured threshold and breakdown voltages were -3.28 and -51 V for the (110) sample and -2.54 and -46 V for the (100) sample. When E inv was -5 MV/cm, the measured specific on-resistance of the (110) sample was 2.27 Ω-cm2, only 0.64 times as much as the 3.52 Ω-cm2 measured for the (100) sample. It was found that the on-resistance ratio between the p-channel LDMOS fabricated on the (110) and (100) substrates can be reduced by increasing Einv
  • Keywords
    MOS integrated circuits; electric breakdown of solids; integrated circuit technology; -2.54 V; -3.28 V; -46 V; -51 V; LDMOS; Si; breakdown voltages; effective longitudinal gate field; on-resistance; p-channel lateral DMOS; threshold voltages; Boron; Breakdown voltage; Conductivity; MOSFETs; Metallization; Oxidation; Resonant tunneling devices; Rough surfaces; Switching circuits; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.239815
  • Filename
    239815