DocumentCode
960668
Title
Improved RF amplifier mounting scheme
Author
Driscoll, M.M. ; Stephan, F.H.
Author_Institution
Westinghouse Electric Corporation, Baltimore, MD
Volume
68
Issue
9
fYear
1980
Firstpage
1166
Lastpage
1167
Abstract
The use of a conductive, silicone rubber-based wafer is described in conjunction with RF amplifier module installation on double-sided printed wiring boards. The new method provides for device heat sinking, device pin stress relief, and low impedance device ultrahigh frequency (UHF) ground connection for achieving cost-effective reliable device performance.
Keywords
Heat sinks; Impedance; Military equipment; Pins; Radio frequency; Radiofrequency amplifiers; Soldering; Thermal resistance; Thermal stresses; Wiring;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1980.11815
Filename
1456084
Link To Document