Title :
Statistics of solder joint alignment for optoelectronic components
Author :
McGroarty, John ; Borgensen, P. ; Yost, Boris ; Li, Che-Yu
Author_Institution :
Dept. of Mater. Sci. & Eng., Cornell Univ., Ithaca, NY, USA
fDate :
8/1/1993 12:00:00 AM
Abstract :
The use of an area array of solder joints allows the self-alignment of a large number of components in microelectronic packages. The sensitivity to statistical variations in solder joint volumes is investigated. The analysis shows that sufficiently large arrays of randomly distributed volumes lead to very narrow distributions in the height and tilt of one component relative to another
Keywords :
optoelectronic devices; packaging; soldering; statistical analysis; area array; microelectronic packages; optoelectronic components; self-alignment; solder joint alignment; solder joint volumes; statistical variations; Lead; Lithography; Optical waveguides; Packaging; Reproducibility of results; Silicon; Soldering; Springs; Statistics; Waveguide lasers;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
