Title :
Metallic Finish Systems for Microelectronic Components
Author :
Zakraysek, Louis
Author_Institution :
General Electric Comp., NY
fDate :
12/1/1981 12:00:00 AM
Abstract :
The metallic finish system on electronic components can affect the quality of components and the reliability of assembled circuits. During the past two years, intensive industry-military effort has been conducted toward the goal of improved finish systems for electronic equipment used in military applications. The work described here is part of the effort which has resulted in a redefinition of metallic finish standards. Further elucidation of some specific and persistent user-assembler problem areas that occur with finishes of substandard quality also are offered.
Keywords :
Integrated circuit fabrication; Aging; Circuit testing; Electronic components; Electronics packaging; Gold; Impurities; Intermetallic; Lead; Microelectronics; Protection;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1981.1135834