DocumentCode :
961194
Title :
Metallic Finish Systems for Microelectronic Components
Author :
Zakraysek, Louis
Author_Institution :
General Electric Comp., NY
Volume :
4
Issue :
4
fYear :
1981
fDate :
12/1/1981 12:00:00 AM
Firstpage :
462
Lastpage :
466
Abstract :
The metallic finish system on electronic components can affect the quality of components and the reliability of assembled circuits. During the past two years, intensive industry-military effort has been conducted toward the goal of improved finish systems for electronic equipment used in military applications. The work described here is part of the effort which has resulted in a redefinition of metallic finish standards. Further elucidation of some specific and persistent user-assembler problem areas that occur with finishes of substandard quality also are offered.
Keywords :
Integrated circuit fabrication; Aging; Circuit testing; Electronic components; Electronics packaging; Gold; Impurities; Intermetallic; Lead; Microelectronics; Protection;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1981.1135834
Filename :
1135834
Link To Document :
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