Compact thermal networks for modeling packages

Author

Codecasa, Lorenzo ; D´Amore, Dario ; Maffezzoni, Paolo

Author_Institution

Dipt. di Elettronica e Informazione, Politecnico di Milano, Milan, Italy

Volume

27

Issue

1

fYear

2004

fDate

3/1/2004 12:00:00 AM

Firstpage

96

Lastpage

103

Abstract

In this paper, thermal networks for modeling packages are rigorously introduced. A multipoint moment matching method for state space reduction of these discretized thermal networks is formulated. In this manner reduced thermal networks are derived that can be used as boundary condition independent compact thermal models of packages. This algorithm is successfully applied to the detailed analysis of an idealized ball grid array package.

Keywords

reduced order systems; semiconductor device models; semiconductor device packaging; state-space methods; thermal management (packaging); BGA package; ball grid array package; boundary condition; compact thermal networks; discretized thermal networks; multipoint moment matching; package modeling; reduced thermal networks; state space reduction; thermal package models; Algorithm design and analysis; Boundary conditions; Electronics packaging; Equations; Power generation; Shape; State-space methods; Temperature distribution; Thermal conductivity; Vectors;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2004.825796

Filename

1288311