Title :
An All Thick-Film Stripline Construction
Author :
Ahmad, Munawar ; Riad, Sedki M. ; Riad, Aicha A R ; Stephenson, F. William
Author_Institution :
Virginia Polytechnic Institute and State Univ, Blacksburg, VA, USA
fDate :
9/1/1982 12:00:00 AM
Abstract :
Design and construction details of an all thick-film stripline (ATFSL) are presented. The new construction offers the advantage of direct access to the ground plane and is suitable for the attachment of active components in chip form. Several striplines were fabricated to study the relation between the dielectric layer thickness and the characteristic impedance of the line. The electric parameters of the fabricated line were measured and compared to theoretical values.
Keywords :
Stripline; Thick-film circuits; Ceramics; Conductors; Dielectric constant; Dielectric materials; Dielectric substrates; Impedance; Packaging; Radio frequency; Stripline; Strips;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1982.1135975
