DocumentCode
962899
Title
Evalutating the MIL-STD-883B Alternate Die Visual Screen for LSI
Author
Bendure, Albert O.
Author_Institution
Bendix Corp, Kansas City, MO, USA
Volume
5
Issue
4
fYear
1982
fDate
12/1/1982 12:00:00 AM
Firstpage
355
Lastpage
360
Abstract
Trends towards further miniaturization in very high speed integrated circuits (VHS1C), as well as complex large-scale integrated (LSI) circuits, support the fact that visual inspection will not be able to adequately screen future microcircuits. Method 5004 in MILSTD-883B offers an alternate to the standard method 2010 visual inspection. An evaluation was performed to see if the method 5004 alternate could be implemented on 7 µm technology metal-gate complementary metal-oxide-semiconductor (CMOS) devices while maintaining the same reliability and performance as devices inspected to method 2010 criteria. The results show no degradation in reliability or performance while increasing visual inspection yield by 90 percent and reducing inspection time from 250 to 500 percent.
Keywords
CMOS integrated circuits; Inspection; Integrated circuit testing; Military standards; Fabrication; Inspection; Large scale integration; Manufacturing; Metallization; Microelectronics; Packaging; Passivation; Temperature; Testing;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1982.1136003
Filename
1136003
Link To Document