DocumentCode :
963307
Title :
Analysis of back-gate effect on breakdown behaviour of over 600V SOI LDMOS transistors
Author :
Qiao, M. ; Zhang, B. ; Li, Z.J. ; Fang, J.
Author_Institution :
Univ. of Electron. Sci. & Technol. of China, Chengdu
Volume :
43
Issue :
22
fYear :
2007
Abstract :
A novel concept of SOI BG REBULF (back-gate reduced bulk field), which breaks through the limitation of vertical breakdown voltage of lateral high-voltage SOI transistors, is proposed. The mechanism of the improved breakdown behaviour is the reduction of bulk electric field in silicon due to field-modulated effect of the interface charges induced by the back-gate voltage. The impact of the back-gate bias on the breakdown behaviour of over 600 V SOI LDMOS transistors is discussed. When the back-gate bias is 330 V the breakdown voltage of the BG REBULF SOI LDMOS is 1020 V which is 47.8% greater than that of the conventional SOI LDMOS.
Keywords :
MOSFET; semiconductor device breakdown; silicon-on-insulator; SOI LDMOS transistors; back-gate effect; back-gate reduced bulk field; breakdown behaviour; vertical breakdown voltage; voltage 600 V;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20071978
Filename :
4375471
Link To Document :
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