Title :
Encapsulation Techniques for Functional Blocks in Molecular Electronics
Author_Institution :
Westinghouse Electric Corporation
fDate :
11/1/1961 12:00:00 AM
Keywords :
Ceramics; Coatings; Design engineering; Encapsulation; Glass; Molecular electronics; Packaging; Protection; Reliability engineering; Shape;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1961.1136130
