DocumentCode :
964535
Title :
Thermally Optimum Arrays of Cards and Fins in Natural Convection
Author :
Bar-Cohen, Avram ; Rohsenow, Warren M.
Author_Institution :
Ben-Gurion University, Beer-Sheva, Israel
Volume :
6
Issue :
2
fYear :
1983
fDate :
6/1/1983 12:00:00 AM
Firstpage :
154
Lastpage :
158
Abstract :
Recently derived analytic relations for natural convection heat transfer coefficients along isothermal or isoflux channel surfaces are applied to the thermal optimization of printed circuit cards and fin arrays. The procedure used and the governing relations, for both thermally symmetric and asymmetric card arrays, are presented. A similar development for arrays of natural convection fins, addressing the influence of fin thickness on the optimum fin spacing and maximum array heat dissipation, is also shown.
Keywords :
Printed circuits; Thermal factors; Boundary conditions; Electronic equipment; Electronics cooling; Heat transfer; Insulation; Isothermal processes; Mechanical engineering; Printed circuits; Temperature; Transformers;
fLanguage :
English
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
0148-6411
Type :
jour
DOI :
10.1109/TCHMT.1983.1136164
Filename :
1136164
Link To Document :
بازگشت