DocumentCode :
964766
Title :
Hot chips 15 - scaling the silicon mountain
Author :
Flynn, Michael ; Dubey, Pradeep
Author_Institution :
Stanford University
Volume :
24
Issue :
2
fYear :
2004
Firstpage :
7
Lastpage :
9
Keywords :
Chip scale packaging; Cryptography; Decoding; Encoding; Power system reliability; Process design; Robustness; Silicon; Sun; System testing;
fLanguage :
English
Journal_Title :
Micro, IEEE
Publisher :
ieee
ISSN :
0272-1732
Type :
jour
DOI :
10.1109/MM.2004.1289275
Filename :
1289275
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=964766
