Title :
Electrical Design of a High Speed Computer Packaging System
Author :
Davidson, Evan E.
Author_Institution :
IBM Corp, Hopewell Junction, NY, USA
fDate :
9/1/1983 12:00:00 AM
Abstract :
A methodology for optimizing the design of an electrical packaging system for a high speed computer is described The pertinent parameters are first defined and their sensitivities are derived so that the proper design trade-offs can ultimately be made. From this procedure, a set of rules is generated for driving a computer-aided design (CAD) system. Finally there is a discussion of design optimization and circuit and package effects on machine performance.
Keywords :
Computer power supplies; Integrated circuit packaging; Large-scale integration; Design automation; Design optimization; Impedance; Integrated circuit interconnections; Integrated circuit packaging; Optimization methods; Packaging machines; Power distribution; Signal design; Voltage;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1983.1136188
