Title :
Improved Electrical Performance Required for Future MOS Packaging
Author :
Schaper, Leonard W. ; Amey, Daniel I.
Author_Institution :
Bell Laboratories, Murray hill, NJ, USA
fDate :
9/1/1983 12:00:00 AM
Abstract :
High speed integrated circuit (IC) families and the demands which these devices place on interconnection and power systems are compared, concluding that new materials, components, and packaging techniques are required to provide a nonlimiting electrical environment for high performance systems using metal-oxide semiconductor (MOS) technologies.
Keywords :
Integrated circuit interconnections; Integrated circuit packaging; Interconnections, Integrated circuits; MOS integrated circuits; CMOS logic circuits; CMOS technology; Frequency; High speed integrated circuits; Integrated circuit interconnections; Integrated circuit packaging; MOS devices; Power supplies; Power system interconnection; Voltage;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCHMT.1983.1136189
