Evaluation of Mechanical Properties of Thin Wires for Electrical Interconnections

A miniaturized universal testing machine was used to measure the yield stress, elastic and anelastic modulus, load relaxation, and low cycle fatigue properties of bonding wires. These material properties were found to be sensitive to the mierostructure of the material produced by a variety of thermal and mechanical treatments. The relations established between structure and properties can potentially be used as a basis for optimizing the bonding wire perform- ance.