Author_Institution :
McDonnell Aircraft Corporation
fDate :
12/1/1962 12:00:00 AM
Keywords :
Aerospace electronics; Costs; Electronics packaging; Fabrication; Immune system; Laboratories; Packaging machines; Printed circuits; Semiconductor device packaging; Welding;
Journal_Title :
Product Engineering and Production, IRE Transactions on
DOI :
10.1109/TPEP.1962.1136317