DocumentCode
966728
Title
Pulsed wave interconnect
Author
Wang, Pingshan ; Pei, Gen ; Kan, Edwin Chih-Chuan
Author_Institution
Sch. of Electr. & Comput. Eng., Cornell Univ., Ithaca, NY, USA
Volume
12
Issue
5
fYear
2004
fDate
5/1/2004 12:00:00 AM
Firstpage
453
Lastpage
463
Abstract
Pulsed wave interconnect is proposed for global interconnect applications. Signals are represented by localized wave-packets that propagate along the interconnect lines at the local speed of light to trigger the receivers. Energy consumption is reduced through charging up only part of the interconnect lines and using the voltage doubling property of the receiver gate capacitances. In a 0.18-/spl mu/m CMOS technology case study, SPICE simulations show that pulsed wave interconnect can save up to 50% of energy and /spl sim/30% of chip area in comparison with the repeater insertion method. A proposed signal splitting structure provides reasonable isolations between different receivers. Measured S-parameters of 3.8-mm interconnect lines fabricated through CMOS foundry showed that the distortion and attenuation of a pico second signal are much less serious than the theoretical predictions. Pulsed wave interconnect also enables time division application of a single line to boost its bit rate capacity. The use of nonlinear transmission lines (NLTL) is also proposed to overcome pulse broadening and attenuation caused by dispersion and frequency-dependent losses. Pulsed waves on an NLTL may be generated, transmitted, split and detected with components realizable in bulk and SOI CMOS technologies. Tapered NLTL can be used for pulse compression. NLTL edge sharpening abilities may be applicable for signal rise time control.
Keywords
CMOS integrated circuits; S-parameters; SPICE; VLSI; integrated circuit interconnections; integrated circuit modelling; silicon-on-insulator; transmission line theory; 0.18 micron; 3.8 mm; CMOS technology; S-parameters; SOI CMOS; SPICE simulations; VLSI; attenuation; edge sharpening; energy consumption; frequency-dependent losses; global interconnect applications; interconnect lines; localized wave-packets; nonlinear transmission lines; pulse broadening; pulsed wave interconnect; receiver gate capacitances; signal rise time control; signal splitting structure; voltage doubling; wafer-scale-integration; Attenuation; CMOS technology; Capacitance; Distortion measurement; Energy consumption; Isolation technology; Optical propagation; Repeaters; SPICE; Voltage;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2004.826196
Filename
1291424
Link To Document