• DocumentCode
    967937
  • Title

    Electrical Parameter Analysis from Three-Dimensional Interconnection Geometry

  • Author

    Kamikawai, Ryotaro ; Nishi, Masaaki ; Nakanishi, Keiichiro ; Masaki, Akira

  • Author_Institution
    Hitachi Ltd., Kokubunji, Tokyo, Japan
  • Volume
    8
  • Issue
    2
  • fYear
    1985
  • fDate
    6/1/1985 12:00:00 AM
  • Firstpage
    269
  • Lastpage
    274
  • Abstract
    TRISIM1, a capacitance and inductance calculation program for complex three-dimensional geometries, is described. The basic algorithm of capacitance calculation is Green´s function integral equation method and the inductances are calculated by Neumann´s formula applied to the thin filaments which make up the conductor segment. In TRISIM1, for efficient use of these algorithms, 1) triangular capacitance cells are adopted, 2) the calculation of the matrix element Gijis simplified according to the cell distance, and 3) the filaments for inductance calculation are infinitely thin. An approximate method of filament selfinductance calculation is used and the proof of its validity is given. The convergence of the numerical results to analytical or two-dimensional solutions is illustrated for simple geometries. The crosstalk noise induced among connector pins is calculated and the results are in good agreement with the measured data.
  • Keywords
    Capacitance calculations; Inductance calculations; Integrated circuit interconnections; Integrated circuit packaging; Interconnections, Integrated circuits; Capacitance; Conductors; Connectors; Convergence of numerical methods; Crosstalk; Geometry; Green´s function methods; Inductance; Integral equations; Pins;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1985.1136497
  • Filename
    1136497