DocumentCode
968105
Title
Depth profiling of integrated circuits with thermal wave electron microscopy
Author
Rosencwaig, A.
Author_Institution
University of California, Lawrence Livermore Laboratory, Livermore, USA
Volume
16
Issue
24
fYear
1980
Firstpage
928
Lastpage
930
Abstract
Nondestructive depth profiling of integrated circuits is performed with thermal wave electron microscopy at 640 kHz modulation frequency.
Keywords
electron microscope applications; integrated circuit testing; nondestructive testing; integrated circuits; nondestructive depth profiling; thermal wave electron microscopy;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19800662
Filename
4245436
Link To Document