DocumentCode
969346
Title
Solder Sealing Semiconductor Packages
Author
Mackay, Colin A. ; Levine, S.W.
Author_Institution
Microelectronics and Computer Tech,Austin, TX
Volume
9
Issue
2
fYear
1986
fDate
6/1/1986 12:00:00 AM
Firstpage
195
Lastpage
201
Abstract
After a comparison of current common sealing systems, a review of the development and properties of metal sealing alloys is presented. Development stages leading to a new laminated composite system for seal alloy preforms is described and results are presented of differential thermal analysis (d.t.a.) scans showing reflow characteristics. Also described are the solderability and aging properties of a nickel alloy plated seal lid which together with the alloy constitute a totally new hermetic seal system. Mention is also made of a composite gold plating scheme Currently in development, designed to meet the new updated corrosion requirements of MIL-STD-883.
Keywords
Integrated circuit packaging; Seals; Soldering; Electronics packaging; Encapsulation; Glass; Integrated circuit packaging; Lead; Plastics; Sealing materials; Seals; Semiconductor device packaging; Very large scale integration;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1986.1136636
Filename
1136636
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