• DocumentCode
    969401
  • Title

    Practical Adhesion of an Ag - Pd Thick-Film Conductor: An Acoustic Emission Study of Pull Tests-I: Monitoring System and Initial Adhesion

  • Author

    Whalen, Philip J. ; Blum, John B.

  • Author_Institution
    Rutgers Univ,Piscataway, NJ
  • Volume
    9
  • Issue
    2
  • fYear
    1986
  • fDate
    6/1/1986 12:00:00 AM
  • Firstpage
    161
  • Lastpage
    167
  • Abstract
    The practical adhesion of an Ag-Pd thick-film conductor on 96-percent alumina was investigated using an acoustic emission monitoring system with a 90° bent wire pull-test configuration. The strength values were highest when an interlocking interface between the metal and substrate was formed. The fracturing of the different interfaces developed during under-, over-, and optimum firing conditions was distinguishable from the acoustic emission data recorded during the adhesion tests.
  • Keywords
    Acoustic emission; Thick-film circuit bonding; Acoustic emission; Acoustic testing; Adhesives; Conductors; Frequency; Helium; Ink; Monitoring; Substrates; System testing;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1986.1136641
  • Filename
    1136641
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=969401