DocumentCode
969554
Title
Cooling - Hot zones
Author
Dubin, Israel
Volume
4
Issue
6
fYear
2006
Firstpage
34
Lastpage
39
Abstract
With densely populated boards such as COM-Express modules, you need to look carefully at the system design to ensure that you are taking the heat away effectively. If you don´t, you could find the design is less reliable than it ought to be. A frequently cited benefit of reduced processor size is reduced power consumption. But this is really only true at the level of the individual devices within the chip. The overall power reduction has not progressed at the rate of miniaturisation. As processors became smaller, we have packed more heat generation into that smaller space and the devices now run hotter. With this higher performance, thermal management needs to be addressed, especially in embedded computers that operate in warm environments inside a closed chassis or other densely packed enclosures
Keywords
modules; thermal management (packaging); closed chassis; densely packed enclosures; embedded computers; heat generation; power reduction; processors miniaturisation; system design; thermal management;
fLanguage
English
Journal_Title
Electronics Systems and Software
Publisher
iet
ISSN
1479-8336
Type
jour
Filename
4064887
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