• DocumentCode
    969684
  • Title

    Signature Analysis: Simulation of Inventory, Cycle Time, and Throughput Trade-Offs in Wafer Fabrication

  • Author

    Atherton, Robert W. ; Dayhoff, Judith E.

  • Author_Institution
    In-Motion Technology, CA
  • Volume
    9
  • Issue
    4
  • fYear
    1986
  • fDate
    12/1/1986 12:00:00 AM
  • Firstpage
    498
  • Lastpage
    507
  • Abstract
    Signature analysis provides a powerful heuristic method for the planning of simulation experiments and for the interpretation of simulation results. Signature analysis has been developed within the context of simulation of the dynamics of wafer fabrication operations in integrated circuit manufacturing. Graphical display of cycle time, throughput, and inventory provides a "signature" of the dynamic behavior of a given operation. Signatures of manufacturing operations are used to address several management issues. The effects of unplanned equipment failures are shown. The variation of signatures with initial inventory and with different time frames for management decisions is illustrated. The extension of signature analysis to other simulations is indicated.
  • Keywords
    Integrated circuit fabrication; Manufacturing; Analytical models; Circuit simulation; Context modeling; Displays; Equipment failure; Fabrication; Integrated circuit manufacture; Inventory management; Manufacturing; Throughput;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/TCHMT.1986.1136668
  • Filename
    1136668