DocumentCode
969684
Title
Signature Analysis: Simulation of Inventory, Cycle Time, and Throughput Trade-Offs in Wafer Fabrication
Author
Atherton, Robert W. ; Dayhoff, Judith E.
Author_Institution
In-Motion Technology, CA
Volume
9
Issue
4
fYear
1986
fDate
12/1/1986 12:00:00 AM
Firstpage
498
Lastpage
507
Abstract
Signature analysis provides a powerful heuristic method for the planning of simulation experiments and for the interpretation of simulation results. Signature analysis has been developed within the context of simulation of the dynamics of wafer fabrication operations in integrated circuit manufacturing. Graphical display of cycle time, throughput, and inventory provides a "signature" of the dynamic behavior of a given operation. Signatures of manufacturing operations are used to address several management issues. The effects of unplanned equipment failures are shown. The variation of signatures with initial inventory and with different time frames for management decisions is illustrated. The extension of signature analysis to other simulations is indicated.
Keywords
Integrated circuit fabrication; Manufacturing; Analytical models; Circuit simulation; Context modeling; Displays; Equipment failure; Fabrication; Integrated circuit manufacture; Inventory management; Manufacturing; Throughput;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/TCHMT.1986.1136668
Filename
1136668
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