The influence of boundary locations on wiring capacitance simulation

Author

Shigyo, Naoyuki ; Fukuda, Sanae ; Kat, Koichi

Author_Institution

Toshiba Corp., Kawasaki, Japan

Volume

36

Issue

6

fYear

1989

fDate

6/1/1989 12:00:00 AM

Firstpage

1171

Lastpage

1174

Abstract

The influence of boundary conditions on periodic wiring capacitance simulations is investigated. It is found that the wiring capacitance depends strongly on the boundary locations. The Neumann boundary condition is used at the planes of symmetry which bound the calculation region. For simulating a periodic wiring pattern, the Neumann boundary plane is usually placed at the center of an electrode. However, when the Neumann boundary plane is placed at the center of an insulator between neighboring electrodes, the simulated capacitance becomes 20% larger than that for the usual boundary location. This discrepancy is analyzed and a novel technique for calculating accurate capacitances is proposed

Keywords

VLSI; capacitance; circuit analysis computing; metallisation; Neumann boundary condition; Neumann boundary plane; VLSI design; boundary locations; discrepancy; influence of boundary locations; periodic wiring capacitance simulations; periodic wiring pattern; planes of symmetry; technique for calculating accurate capacitances; Boundary conditions; Capacitance; Electrodes; Geometry; Insulation; Laplace equations; Ultra large scale integration; Very large scale integration; Voltage; Wiring;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.24364

Filename

24364