A Bilevel Thin Film Hybrid Circuit Containing Crossovers, Resistors, Capacitors, and Integrated Circuits

Here is a discussion on the fabrication, characterization, and economic considerations of a set of complex hybrid integrated circuits being used in exploratory switching applications. Several approaches to fabrication are discussed. One approach is unique in that it includes four distinct technologies in addition to simple thin film interconnections. They are (1) beam crossovers, (2) thin film resistors, (3) thin film capacitors, and (4) metallized via holes to a backplane. Alternate approaches including discrete capacitor elements are also discussed.