A Numerical Study on Temperature Increase in the Resistive SFCL Element Due to the Quench Condition

Author

Kim, C.H. ; Lee, K.M. ; Ryu, K.W.

Author_Institution

Dept. of Automotive Eng., Seoul Nat. Univ. of Technol.

Volume

16

Issue

2

fYear

2006

fDate

6/1/2006 12:00:00 AM

Firstpage

636

Lastpage

641

Abstract

A transient numerical simulation was conducted to have variation of temperature on an element of resistive SFCL (Superconducting Fault Current Limiter) under quench condition. It is very important engineering information for an optimum design of cryogenic system for cooling of a resistive SFCL element. A bifilar coil for resistive SFCL for 10 MVA system was incorporated as a model in this numerical study. From the result, it was found that the averaged temperature on the shunt and Bi-2212 element at 500 kW, 100 ms was 711.1 K and 198.4 K respectively. The temperature variation with the change of the hot-spot size and time is also obtained. The maximum temperature was continuously increased in all cases until the hot-spot stops at 100 ms and it was going down after then. Such as, the details of temperature distribution on the SFCL element obtained from this numerical study and it should be very valuable information on the decision of the cooling capacity of cryogenic system

Keywords

bismuth; cooling; cryogenics; fault current limiters; finite volume methods; superconducting devices; temperature distribution; 10 MVA; 198.4 K; 500 kW; 711.1 K; Bi-2212 element; cooling; cryogenic system; finite volume method; quench condition; resistive SFCL; superconducting fault current limiter; temperature distribution; transient numerical simulation; Cooling; Cryogenics; Fault current limiters; Fault currents; High temperature superconductors; Numerical simulation; Superconducting coils; Superconducting materials; Superconducting transmission lines; Switches; Bi-2212; HTS; cryo-cooler; finite volume method (FVM); hot-spot; quench; shunt; superconducting fault current limiter (SFCL);

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/TASC.2006.870520

Filename

1642929