The influence of thermal gradients on the characterization of Schottky-barrier diodes

Author

Chin, Vincent W.L. ; Newbery, Stephen M.

Author_Institution

Sch. of Phys., New South Wales Univ., Kensington, NSW, Australia

Volume

37

Issue

1

fYear

1990

fDate

1/1/1990 12:00:00 AM

Firstpage

301

Lastpage

303

Abstract

A simple and fast method of measuring the electrical performance of a packaged array of Schottky diodes as a function of temperature is described. The technique utilizes the device´s ceramic package as the isolating thermal resistance. The effective thermal conductivity of the experimental arrangement is investigated, allowing the cooling times and temperature distribution of the system to be determined. In particular, attention is given to the variation between device operating temperatures and those obtained from a diode temperature sensor mounted in close proximity to the die

Keywords

Schottky-barrier diodes; cooling; packaging; thermal resistance; Schottky-barrier diodes; ceramic package; cooling times; device operating temperatures; diode temperature sensor; effective thermal conductivity; electrical performance; isolating thermal resistance; packaged array; temperature distribution; thermal gradients; Ceramics; Cooling; Electric resistance; Electric variables measurement; Electrical resistance measurement; Packaging; Schottky diodes; Temperature sensors; Thermal conductivity; Thermal resistance;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.43831

Filename

43831