DocumentCode :
975170
Title :
High-performance MCM routing
Author :
Cho, Jun-dong ; Sarrafzadeh, Majid ; Sriram, Mysore ; Kang, Sung-Mo
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Northwestern Univ., Evanston, IL, USA
Volume :
10
Issue :
4
fYear :
1993
Firstpage :
27
Lastpage :
37
Abstract :
The authors describe the multilayer MCM (multichip module) routing problem, and propose an approach for routing high-performance MCMs with the objective of minimizing interconnect delays and crosstalk. They first introduce an approach for rapidly estimating the time-domain response of lossy transmission line trees, and propose a realistic second-order delay model for MCM interconnects. The delay model is used to guide a performance-driven global routing algorithm. Given the 2-D global paths, the next stage is layer assignment. An effective algorithm for constrained layer assignment is developed. Based on the best-known maxcut approximation algorithm (which performs well in practice), a maximal k-color ordering is formulated for minimizing both interlayer and intralayer crosstalk as well as crossings in 3-D MCM substrates. The authors also propose a strategy that exhibits a good tradeoff between circuit performance and design cost, instead of concentrating exclusively on a single objective such as area minimization.<>
Keywords :
circuit layout CAD; crosstalk; multichip modules; network routing; MCM interconnects; MCM routing; circuit performance; constrained layer assignment; crosstalk; design cost; global routing algorithm; high-performance; interconnect delays; k-color ordering; layer assignment; lossy transmission line trees; maxcut approximation; multilayer; performance-driven; routing problem; second-order delay model; time-domain response; Approximation algorithms; Crosstalk; Delay estimation; Integrated circuit interconnections; Multichip modules; Nonhomogeneous media; Propagation losses; Routing; Time domain analysis; Transmission lines;
fLanguage :
English
Journal_Title :
Design & Test of Computers, IEEE
Publisher :
ieee
ISSN :
0740-7475
Type :
jour
DOI :
10.1109/54.245961
Filename :
245961
Link To Document :
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