DocumentCode
975862
Title
The role of universities in electronic packaging engineering
Author
Prince, J.L. ; Hamilton, Douglas J. ; Matz, Eileen M. ; Staszak, Zbigniew J.
Author_Institution
University of Arizona, Tucson, AZ, USA
Volume
73
Issue
9
fYear
1985
Firstpage
1416
Lastpage
1423
Abstract
Characteristics of present and future problems and directions in Level 1 and Level 2 packaging are discussed. Research areas are delineated, and problems amenable to attack by universities are suggested. An example of an existing university research program is given. Methods for universities to develop and implement courses in electronic packaging are discussed. A three-course core presently in use is described; this core can be used to provide Electronic Packaging Engineering emphasis in the M.S. programs of a number of different departments. Guidelines are suggested for the development of educational programs in Electronic Packaging Engineering, including use of industrial interactions and video education.
Keywords
Costs; Educational institutions; Educational programs; Electronics packaging; Integrated circuit interconnections; Manufacturing; Power engineering and energy; Power system interconnection; Power system reliability; Silicon;
fLanguage
English
Journal_Title
Proceedings of the IEEE
Publisher
ieee
ISSN
0018-9219
Type
jour
DOI
10.1109/PROC.1985.13302
Filename
1457570
Link To Document