• DocumentCode
    975862
  • Title

    The role of universities in electronic packaging engineering

  • Author

    Prince, J.L. ; Hamilton, Douglas J. ; Matz, Eileen M. ; Staszak, Zbigniew J.

  • Author_Institution
    University of Arizona, Tucson, AZ, USA
  • Volume
    73
  • Issue
    9
  • fYear
    1985
  • Firstpage
    1416
  • Lastpage
    1423
  • Abstract
    Characteristics of present and future problems and directions in Level 1 and Level 2 packaging are discussed. Research areas are delineated, and problems amenable to attack by universities are suggested. An example of an existing university research program is given. Methods for universities to develop and implement courses in electronic packaging are discussed. A three-course core presently in use is described; this core can be used to provide Electronic Packaging Engineering emphasis in the M.S. programs of a number of different departments. Guidelines are suggested for the development of educational programs in Electronic Packaging Engineering, including use of industrial interactions and video education.
  • Keywords
    Costs; Educational institutions; Educational programs; Electronics packaging; Integrated circuit interconnections; Manufacturing; Power engineering and energy; Power system interconnection; Power system reliability; Silicon;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/PROC.1985.13302
  • Filename
    1457570