• DocumentCode
    984455
  • Title

    Fast and Optimal Redundant Via Insertion

  • Author

    Lee, Kuang-Yao ; Koh, Cheng-Kok ; Wang, Ting-Chi ; Chao, Kai-Yuan

  • Author_Institution
    Dept. of Comput. Sci., Nat. Tsing Hua Univ., Hsinchu
  • Volume
    27
  • Issue
    12
  • fYear
    2008
  • Firstpage
    2197
  • Lastpage
    2208
  • Abstract
    Redundant via insertion is highly effective in improving chip yield and reliability. In this paper, we study the problem of double-cut via insertion (DVI) in a post-routing stage, where a single via can have, at most, one redundant via inserted next to it and the goal is to insert as many redundant vias as possible. The DVI problem can be naturally formulated as a zero-one integer linear program (0-1 ILP). Our main contributions are acceleration methods for reducing the problem size and the number of constraints. Moreover, we extend the 0-1 ILP formulation to handle via density constraints. Experimental results show that our 0-1 ILP is very efficient in computing an optimal DVI solution, with up to 73.98 times speedup over existing heuristic algorithms.
  • Keywords
    integer programming; integrated circuit reliability; integrated circuit yield; linear programming; redundancy; acceleration methods; chip reliability; chip yield; double-cut via insertion; heuristic algorithms; optimal DVI solution; redundant via insertion; via density constraints; zero-one integer linear program; Acceleration; Added delay; Chaos; Circuits; Electromigration; Helium; Heuristic algorithms; Manufacturing processes; Page description languages; Routing; Integer linear program (ILP); redundant via insertion; via density;
  • fLanguage
    English
  • Journal_Title
    Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2008.2006151
  • Filename
    4670066