• DocumentCode
    984780
  • Title

    An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits

  • Author

    Wu, Tzong-Lin ; Chen, Sin-Ting

  • Author_Institution
    Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei
  • Volume
    16
  • Issue
    7
  • fYear
    2006
  • fDate
    7/1/2006 12:00:00 AM
  • Firstpage
    413
  • Lastpage
    415
  • Abstract
    An electromagnetic crystal power substrate (ECPS) in a high-speed circuit package is proposed for suppressing the power/ground planes noise (P/GPN) and the corresponding electromagnetic interference (EMI). The ECPS is simply realized by periodically embedding the high dielectric-constant rods into the conventional package substrate between the continuous power and ground planes. With a small number of embedded rods and low rod filling ratio, the proposed ECPS design can efficiently eliminate the noise of 30dB in average within several designed stopbands. In addition, the radiation or EMI resulting from the P/GPN is also significantly reduced over 25dB in the stopbands. The excellent noise and EMI suppression performance for the proposed structure are verified both experimentally and numerically. Reasonably good consistency is seen
  • Keywords
    electromagnetic interference; high-speed integrated circuits; integrated circuit noise; integrated circuit packaging; dielectric-constant rods; electromagnetic crystal power substrate; electromagnetic interference; high speed circuit package; power/ground plane noise; Circuit noise; Dielectric substrates; Electromagnetic interference; Filling; Integrated circuit noise; Packaging; Periodic structures; Resonance; Signal to noise ratio; Switching circuits; Electromagnetic interference (EMI); ground bounce noise (GBN); high-speed digital circuits; photonic bandgap structure; power integrity; radiation; simultaneously switching noises (SSNs);
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/LMWC.2006.877124
  • Filename
    1644768