• DocumentCode
    985735
  • Title

    P-MOSFET´s with ultra-shallow solid-phase-diffused drain structure produced by diffusion from BSG gate-sidewall

  • Author

    Saito, Masanobu ; Yoshitomi, Takashi ; Hara, Hisashi ; Ono, Mizuki ; Akasaka, Yasushi ; Nii, Hideaki ; Matsuda, Satoshi ; Momose, Hisayo Sasaki ; Katsumata, Yasuhiro ; Ushiku, Yukihiro ; Iwai, Hiroshi

  • Author_Institution
    Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
  • Volume
    40
  • Issue
    12
  • fYear
    1993
  • fDate
    12/1/1993 12:00:00 AM
  • Firstpage
    2264
  • Lastpage
    2272
  • Abstract
    A p-MOSFET structure with solid-phase diffused drain (SPDD) is proposed for future 0.1-μm and sub-0.1-μm devices. Highly doped ultrashallow p+ source and drain junctions have been obtained by solid-phase diffusion from a highly doped borosilicate glass (BSG) sidewall. The resulting shallow, high-concentration drain profile significantly improves short channel effects without increasing parasitic resistance. At the same time, an in situ highly-boron-doped LPCVD polysilicon gate is introduced to prevent the transconductance degradation which arises in ultrasmall p-MOSFETs with lower process temperature as a result of depletion formation in the p+-polysilicon gate. Excellent electrical characteristics and good hot-carrier reliability are achieved
  • Keywords
    CVD coatings; borosilicate glasses; diffusion in solids; hot carriers; insulated gate field effect transistors; reliability; silicon; 0.1 micron; B2O3-SiO2; BSG; BSG gate-sidewall; LPCVD polysilicon gate; Si:B; depletion formation; electrical characteristics; high-concentration drain profile; highly B-doped polysilicon; highly doped borosilicate glass; highly doped ultrashallow junctions; hot-carrier reliability; p-MOSFET structure; p+ drain junctions; p+ source junctions; short channel effects; solid-phase-diffused drain structure; transconductance degradation; ultra-shallow drain structure; ultrasmall p-MOSFETs; Boron; Degradation; Electric resistance; Electric variables; Insulation; Ion implantation; MOSFET circuits; Temperature; Testing; Transconductance;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.249474
  • Filename
    249474