Title :
A mixed-signal BiCMOS front-end signal processor for high-temperature applications
Author :
Vermesan, Ovidiu ; Blystad, Lars-Cyril Julin ; Bahr, Roy ; Hjelstuen, Magnus ; Beneteau, Lionel ; Froelich, Benoit
Author_Institution :
SINTEF, Oslo
fDate :
7/1/2006 12:00:00 AM
Abstract :
A mixed-signal ASIC that implements an ultrasound front-end receiver in a 0.6 mum BiCMOS HotASIC technology that features metal/metal capacitors and poly1/poly2 resistors is described. The ASIC includes a low-noise amplifier (LNA), a programmable gain amplifier (PGA), an output differential amplifier (ODA), and a second-order sigma-delta modulator (SDM), and is the most compact system for high-temperature ultrasound applications reported in literature. The circuit has a programmable gain and is designed for measuring the signal response (200 kHz to 700 kHz) from an ultrasound transducer. At 48 MHz clock frequency and 200degC, the power consumption is 85 mW from a single 5 V supply. The die area of the chip is 5.52 mm2
Keywords :
BiCMOS integrated circuits; acoustic receivers; high-temperature electronics; mixed analogue-digital integrated circuits; ultrasonic devices; 0.6 micron; 200 C; 200 to 700 kHz; 48 MHz; 5 V; 85 mW; BiCMOS HotASIC technology; low-noise amplifier; mixed analog-digital integrated circuits; output differential amplifier; programmable gain amplifier; sigma-delta modulator; signal processor; ultrasonic imaging; ultrasound transducer; Application specific integrated circuits; BiCMOS integrated circuits; Capacitors; Delta-sigma modulation; Differential amplifiers; Electronics packaging; Low-noise amplifiers; Resistors; Signal processing; Ultrasonic imaging; Array signal processing; BiCMOS integrated circuits; high-temperature electronics; mixed analog–digital integrated circuits; sigma-delta modulation; ultrasonic imaging;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2006.873675
