Title :
Microelectromechanical systems
Author :
Mehregany, Mehran
Author_Institution :
Dept. of Electr. Eng. & Appl. Phys., Case Western Reserve Univ., Cleveland, OH, USA
fDate :
7/1/1993 12:00:00 AM
Abstract :
The microfabrication techniques used to develop high-performance closed-loop-controlled microelectromechanical systems (MEMS) are discussed. A generalized MEMS could consist of mechanical components, sensors, actuators, and electronics, all integrated in the same environment. Bulk and surface micromachining, substrate bonding, and electroforming in conjunction with X-ray lithography, all integral components of silicon micromachining, are described. The development of a materials base for MEMS and a variety of physical phenomena for microactuator applications that have recently been demonstrated are reviewed. The applications and future trends of MEMS technologies are discussed.<>
Keywords :
X-ray lithography; closed loop systems; electric actuators; electric sensing devices; integrated circuit technology; mechatronics; micromechanical devices; small electric machines; Si; X-ray lithography; actuators; closed-loop-controlled; electroforming; integrated electronics; mechanical components; microelectromechanical systems; microfabrication techniques; micromachining; sensors; substrate bonding; Actuators; Bonding; Mechanical sensors; Microactuators; Microelectromechanical systems; Micromachining; Micromechanical devices; Sensor phenomena and characterization; Silicon; X-ray lithography;
Journal_Title :
Circuits and Devices Magazine, IEEE
