Title :
The characteristics of CMOS devices in oxygen-implanted silicon-on-insulator structures
Author :
Mao, Bor-yen ; Sundaresan, Ravishankar ; Chen, C. E Daniel ; Matloubain, M. ; Pollack, Gordon
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
fDate :
5/1/1988 12:00:00 AM
Abstract :
The characteristics of CMOS devices fabricated in oxygen-implanted silicon-on-insulator (SOI) substrates with different oxygen doses are studied. The results show that transistor junction leakage currents are improved by orders of magnitude when the oxygen dose is decreased from 2.25×1018 cm-2 to 1.4×1018 cm-2 . The floating-body effect, i.e. transistor turn-on at lower gate voltage with dramatic improvement in subthreshold slope when the drain voltage is increased, is enhanced by the reduction in leakage current and hence the oxygen dose. In SOI substrates implanted with 1.4×1017 cm-2 oxygen dose and annealed at 1150°C, back-channel mobilities are decreased by several orders of magnitude compared to the mobilities in the precipitate-free silicon film. These device characteristics are correlated with the microstructure at the silicon-buried-oxide interface, which is controlled by oxygen implantation and post-oxygen-implantation anneal
Keywords :
CMOS integrated circuits; elemental semiconductors; insulated gate field effect transistors; ion implantation; leakage currents; semiconductor-insulator boundaries; silicon; CMOS devices; SOI substrates; Si-SiO2; Si:O+; back-channel mobilities; floating-body effect; ion implantation; microstructure; post-oxygen-implantation anneal; subthreshold slope; transistor junction leakage currents; transistor turn-on; Annealing; Implants; Instruments; Leakage current; Microstructure; Process design; Semiconductor films; Silicon on insulator technology; Substrates; Voltage;
Journal_Title :
Electron Devices, IEEE Transactions on
