Electrical and magnetic studies on gain boundary segregation in a Ni-3 at.%Sn alloy

Author

Yao, Y.D. ; Chuang, T.H. ; Lee, C.K.

Author_Institution

Inst. of Phys., Acad. Sinica, Taipei, Taiwan

Volume

25

Issue

5

fYear

1989

fDate

9/1/1989 12:00:00 AM

Firstpage

3958

Lastpage

3960

Abstract

The variations of the grain boundary precipitation, the electrical resistivity, and the magnetization of an Ni-3 at.%Sn alloy have been investigated as a function of annealing time and annealing temperature. The average growth rate of the grain boundary precipitates for samples annealed at 773 K is roughly 7 μ per week. The residual electrical resistivity for samples annealed at 773 K decreases roughly by 0.6 μΩ-cm per week. All the electrical and magnetic properties in the annealed samples vary monotonically with respect to the degree of grain boundary precipitation and segregation

Keywords

annealing; electrical conductivity of crystalline metals and alloys; ferromagnetic properties of substances; grain boundary segregation; grain growth; magnetisation; nickel alloys; precipitation; tin alloys; 773 K; Ni-3 at.%Sn alloy; Ni-Sn alloy; annealing temperature; annealing time; electrical resistivity; gain boundary segregation; grain boundary precipitation; growth rate; magnetic properties; magnetization; Aging; Annealing; Electric resistance; Grain boundaries; Intermetallic; Kinetic theory; Magnetosphere; Tail; Temperature; Tin;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/20.42489

Filename

42489