DocumentCode :
994845
Title :
GaAs MESFET physical models for process-oriented design
Author :
Snowden, Christopher M. ; Pantoja, Renato R.
Author_Institution :
Dept. of Electron. & Electr. Eng., Leeds Univ., UK
Volume :
40
Issue :
7
fYear :
1992
fDate :
7/1/1992 12:00:00 AM
Firstpage :
1401
Lastpage :
1409
Abstract :
A detailed physical model which is used to accurately predict the DC and microwave performance of GaAs MESFETs is described. This model, which accounts for hot electron effects in submicron FETs, includes trapping phenomena and heating due to power dissipation. It is used to determine the optimal design for small-signal and power devices, including single- and double-recessed FETs. The spread in device characteristics can be directly related to the variation in device geometry and process parameters experienced in fabrication. The accuracy and flexibility of this approach are demonstrated by comparison with measured data for a variety of devices
Keywords :
III-V semiconductors; Schottky gate field effect transistors; electron traps; gallium arsenide; hole traps; hot carriers; semiconductor device models; solid-state microwave devices; DC performance; GaAs; MESFET; charge control model; device characteristics; device geometry; double-recessed FETs; heating; hot electron effects; microwave performance; physical models; power devices; power dissipation; process parameters; process-oriented design; single-recessed FETs; submicron FETs; trapping phenomena; Electromagnetic heating; Electron traps; FETs; Gallium arsenide; Geometry; MESFETs; Microwave devices; Power dissipation; Predictive models; Process design;
fLanguage :
English
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9480
Type :
jour
DOI :
10.1109/22.146321
Filename :
146321
Link To Document :
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