مس خالص تجاري با استحكام و رسانايي بالا ، توليد شده به روش اتصال نوردي تجمعي (ARB)

High-Strength, High-Conductivity Ultra-Fine grains Commercial Pure Copper Produced by ARB Process

Accumulative roll-bonding process is a severe plastic deformation process capable of developing grains below lpm in diameter and to improve mechanical properties. In this study, strips of a commercial pure Copper were Accumulative roll-bonding processed to eight cycles, and their microstructures, mechanical properties and electrical conductivity were investigated. Microstructural characterizations were done by transmission electron microscopy. Transmission electron microscopy studies of the strips at different stage of Accumulative roll-bonding process showed grain refinement, and the transmission electron microscopy micrographs of the strips Accumulative roll-bonded for eight cycles showed ultra-fine grains of high angle grain boundaries ~ 180 nm in size. The ambient tensile strength and microhardness of the Accumulative roll-bonding processed samples increased with the number of Accumulative roll-bonding cycles. Whereas, the elongation dropped abruptly at the first cycles, above which it increased slightly. With increasing Accumulative roll-bonding process up to 6 cycles, the electrical conductivity decreased and then increased up to 8 Accumulative roll-bonding cycles.