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Session 3: Video and image processing
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Session 3: VLSI/Quantum circuit design
3
Session 3: Web engineering and web applications (WEA)
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Session 3: Wireless network architecture
5
Session 30 - CMOS and Interconnect Reliability - Gate Dielectric Reliability - Breakdown, and Device Degradation Mechanism
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Session 30 digital control techniques II
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Session 30 Electron tubes — Cathodes
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Session 30 Electron tubes — Reliability, cathodes and optics
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Session 30 Integrated circuits — Bipolar and buried-layer MOS structures
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Session 30 Integrated circuits — Non-volatile memory: Devices & modeling
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Session 30 overview - displays and biosensors
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Session 30 overview: Technologies for next-generation systems: Technology directions subcommittee
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Session 30 Radio frequency interference
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Session 30 Solid state devices — High voltage integrated circuits and devices
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Session 30 Solid state devices — Novel devices and materials
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Session 30: Panel discussion
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Session 30: Quantum, power, and compound semiconductors devices - heterostructure high-speed devices
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Session 31 Engineering management I
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Session 31 induction motor drives
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Session 31- Modeling and Simulation - Compact Modeling
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Session 31 overview - mass storage
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Session 31 Quantum electronics and compound semiconductor devices — Photodetectors
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Session 31 Solid state devices — Novel devices & technologies
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Session 31 Solid-state devices — Hot carrier effects
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Session 31 Solid-state devices — MOSFET scaling
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Session 31: Alternative energy sources
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Session 31: Solid-state and nanoelectronic devices - silicon nanowire transistors
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Session 32 - Displays, Sensors and MEMS - Thin Film Transistors
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Session 32 Communications sytems
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Session 32 Device technology — Advanced bipolar technology
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Session 32 Device technology — Isolation & lithography
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Session 32 overview - advanced array structures
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Session 32 power electronics applications active filters
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Session 32 Quantum electronics and compound-semiconductor devices — High speed III-V MESFETs/MISFETs
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Session 32: Characterization, reliability, and yield - defect characterization and dielectric breakdown
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Session 32: EMC and grounding & bounding
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Session 33 - Quantum Electronics and Compound Semiconductors - GaN-based Power Devices
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Session 33 AC-DC converters modeling and control
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Session 33 Antennas and electromagnetic waves
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Session 33 Electron tubes — New technology and analysis
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Session 33 Solid state devices — Lightly-doped drain MOSFETs
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Session 33 Solid-state devices — High voltage IC´s and lateral power devices
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Session 33: Memory technology - DRAM and NOR
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Session 33: UPS systems and applications
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Session 34 - Process Technology - High-k II: Interfaces and Materials Properties
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Session 34 Device technology — SOI and 3-D technologies
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Session 34 inverter III
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Session 34 Quantum electronics and compound semiconductor devices — Lasers
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Session 34 Space and propulsion instrumentation
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Session 34: Energy storage
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Session 34: Memory technology - nanoscale poly-FG and charge trap flash non-volatile memories
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Session 35 - CMOS Devices Advanced - Gate-Stack Devices
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Session 35 batteries, UPS power dist.
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Session 35 Electron tubes — Fast wave devices
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Session 35 Electron tubes — Fast wave tubes
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Session 35 Transmission in processing of information
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Session 35: CMOS devices and technology - alternative MOSFET device architectures and materials
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Session 35: Converters and control techniques
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Session 36 - Integrated Circuits and Manufacturing - Floating-Gate and Discrete Trap Non-Volatile Memory
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Session 36 Microwave devices and techniques
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Session 36: Converters and control techniques
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Session 36: Modeling and simulation enhanced mobility and III-V devices
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Session 37 - Solid State Devices Emerging Memories
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Session 37 Broadcasting
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Session 37: Process Technology - advanced source-drain engineering and memory processing
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Session 37: UPS systems and applications
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Session 38 Panel: Engineering management II: Outlooks on electronics for engineers and management
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SESSION 38: CMOS and interconnect reliability ESD, soft errors and backend reliability issues for nanoscale CMOS technologies
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Session 38: Converters and control techniques
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Session 39 Communications transmission
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Session 39: Lithium batteries
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Session 3A - Embedded tutorial: opportunities and challenges with double-gated devices
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Session 3a - Wireless networks [breaker page]
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Session 3a Inverters and Converters II
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Session 3A Network management and Traffic engineering II
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Session 3A on-chip networks - I
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Session 3A traffic management
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Session 3A: Circuit Design Verification
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Session 3A: Crosstalk-Aware Timing and Noise Analysis
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Session 3A: IPTV, LBS, internet telephony [breaker page]
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Session 3A: Next generation network technology
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Session 3A: Next Generation Network Technology (II)
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Session 3a: Passive radars III focused session
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Session 3A: Simulation and active filters
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Session 3A: Wireless communication technology (III)
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Session 3A: Wireless communication technology (III)
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Session 3B - Routing and application specific NoC architectures
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Session 3B - RRAM II
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Session 3b distributed performance
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Session 3b Modeling and Analysis II
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Session 3B processor microarchitecture - I
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Session 3B Tools and techniques for network simulation and measurement II
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Session 3B video & mobile games
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Session 3b: Automotive radars focused session
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Session 3B: CDMA and Wireless Communications (III)
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Session 3B: e-government and e-services [breaker page]
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Session 3B: Mobile communications (III)
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Session 3B: Power converters
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Session 3B: System Software Optimizations
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Session 3B: Test Trends and SiP Testing
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Session 3B: Wideband wireless communication
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Session 3B: Wireless sensor network (III)
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Session 3C - Memory driven code and architecture optimizations
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Session 3C Network issues for multimedia, web and gaming applications II
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Session 3C web applications
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Session 3C: Information Security Technology (III) : Cryptography
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Session 3C: IT service technology (I)
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Session 3C: New Directions in Verification
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Session 3C: Next Generation Network Technology (III)
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Session 3C: Optical networking technology
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Session 3C: Signal processing I
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Session 3C: Smart services [breaker page]
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Session 3D - Exploiting arithmetic constructs in verification
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Session 3D Peer-to-peer and overlay networking I
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Session 3D: Algorithms and Modeling Techniques for Bio and Nano Technologies
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Session 3D: Digital broadcasting technology (I)
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Session 3D: Multimedia and Internet Systems and Services (III)
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Session 3D: Network & information security
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Session 3D: RFID & USN technologies (III)
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Session 3D: Systems & circuits for communications
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Session 3D: Wireless communication 3 [breaker page]
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Session 3E: IT Service Technology and Marketing Aspects
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Session 3E: Signal processing II & optical communications
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Session 3E: Systems & software engineering (III)
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Session 3F: Antennas and propagation
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Session 3F: Communication network topology & planning (I)
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Session 3F: NGN and future network 2 [breaker page]
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Session 4
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Session 4
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Session 4
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Session 4
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Session 4
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Session 4 - Devices and Monolithic Circuit Elements [breaker page]
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Session 4 - DRAM I
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Session 4 - Frequency Synthesizers and Oscillators
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Session 4 - High-speed test, characterization, and debug
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Session 4 - image processing and vision
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Session 4 - Microwave Generation and Amplification [breaker page]
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Session 4 - Microwave Theory [breaker page]
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Session 4 - Oversampling converters
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Session 4 - Passive Microwave Components [breaker page]
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Session 4 - Process Technology Fully-Silicided (FUSI) Gates
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Session 4 - Short papers 2
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Session 4 - Waveguides - Techniques and Analysis [breaker page]
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Session 4 — Frequency and phase generation techniques
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Session 4 (special session): Modern localisation techniques
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Session 4 (Special session): Visual scene analysis on hybrid multicore
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Session 4 ? Reliability modeling
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Session 4 ?PHM design techniques and algorithms
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Session 4 Abstract: Mobile Application Development
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Session 4 Activity support
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Session 4 CAD and Device Modelling
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Session 4 data acquisition circuits [breaker page]
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Session 4 Device technology — Advanced GaAs technology
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Session 4 formal opening of conference [breaker page]
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Session 4 formal opening of conference [breaker page]
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Session 4 Hardware Trojans
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Session 4 high-speed circuit technology [breaker page]
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Session 4 macromodeling by vector fitting
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Session 4 Microwave Techniques in Industrial, Scientific and Medical/Biological Applications
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Session 4 overview - mixed-domain systems
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Session 4 overview / high-performance digital: Enterprise processors & components
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Session 4 overview backplane interconnects and clock multipliers [breaker page]
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Session 4 overview computer-aided design I/modeling [breaker page]
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Session 4 Overview High-speed data converters
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Session 4 overview: Analog techniques
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Session 4 overview: DC-DC converters: Analog subcommittee
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Session 4 overview: Harvesting & wireless power
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Session 4 Overview: Oversampled ADCs
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Session 4 overview: Processors: High-performance digital subcommittee
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Session 4 overview: RF techniques: RF subcommittee
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SESSION 4 Parameter Extraction
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Session 4 photo voltaic power sources
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Session 4 Point and counterpoint of engineering and education
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Session 4 Poster session
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Session 4 Power Supplies
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Session 4 Quantum electronics and compound semiconductor devices — New heterojunction electron devices
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Session 4 Quantum electronics and compound-semiconductor devices — High speed III-V semiconductor devices
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Session 4 Quantum electronics and compound-semiconductor devices — Novel heterostructure devices
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Session 4 reliability
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Session 4 Security
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Session 4 semiconductor memories [breaker page]
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Session 4 semiconductor memory I [breaker page]
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Session 4 Signal and power integrity
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Session 4 Solid state devices — High power FETs
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Session 4 Solid state devices — High voltage integrated circuits
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Session 4 Solid state devices — Hot carriers in MOSFETs
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Session 4 Solid state devices — Power transistors
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Session 4. Methods and tools for the design of expert systems and decision support systems
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Session 4.1 —Uncertainty problems
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Session 4.1 Bandwidth Management
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Session 4.2 —Fault diagnosis and prognosis for gearboxs
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Session 4.2 Short Papers II
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Session 4.3 — Interconnect and package reliability assessment
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Session 4.3 EESD Application and Traffic Specific Service Differentiation
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Session 4.4 — Storage stability and Life Prediction
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Session 4.5 — Built-in-test
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Session 4.A: Fault simulation
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Session 4.B: Power optimization
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Session 4/5 - Formal opening of conference / keynote address
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Session 4/5 - Formal opening of conference / keynote address [breaker page]
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Session 4/5 formal opening of conference / keynote address [breaker page]
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Session 4: Advanced applications
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Session 4: Application track
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Session 4: Applications of NNs 3: Image and signal procesing
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Session 4: Assertions and Transactions
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Session 4: Automotive communication
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Session 4: Cloud security
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Session 4: Code generation techniques
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Session 4: Co-design — Part II
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Session 4: Cryptography
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Session 4: Data mining and semantic web (DMSW)
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Session 4: Data quality
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Session 4: Debug
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Session 4: Dependable and fault-tolerant systems
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Session 4: Devices & Monolithic Circuit Elements
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Session 4: Displays, sensors, and MEMS — thin-film devices and memory
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Session 4: E-health
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Session 4: E-health
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Session 4: E-Learning
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Session 4: Experimentation in the Process Framework
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Session 4: Formal methods [breaker page]
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Session 4: Formal verification
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Session 4: High voltage direct current (HVDC)
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Session 4: Hydrogeophysics & EM soil property estimation II
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Session 4: Index
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Session 4: Industrial Measurements
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Session 4: Industrial session
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Session 4: Information and communication technology - I
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Session 4: Information and network security
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Session 4: Information security
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Session 4: Information security
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Session 4: Information security and biometrics
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Session 4: Intelligent control
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Session 4: Intelligent data management
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Session 4: Interconnect Systems
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Session 4: Internet applications and technology
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Session 4: Internet applications and technology
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Session 4: Java and Jini [breaker page]
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Session 4: Memory optimization issues
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Session 4: MPSoCs
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Session 4: Multi-processor architectures for image and signal processing chair: Jean François Nezan, INSA Rennes
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Session 4: Network security
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Session 4: Neural networks in modelling and applications
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Session 4: Operating systems and virtualization
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Session 4: Photonic technologies for wireless communication systems
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Session 4: Poster
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Session 4: Poster session
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Session 4: Quantum electronics and energy conversion devices—MIS solar cells [breaker page]
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Session 4: Reliability
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Session 4: RF
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Session 4: Secure technologies
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Session 4: Security and Network Processors
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Session 4: Self monitoring
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Session 4: Signal and image processing on GPU
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Session 4: Signal processing on reconfigurable architectures
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Session 4: Social network
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Session 4: Special session 4A: Apprentice - VTS edition: Season 3
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Session 4: special session on environmental applications of computational intelligence 1
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Session 4: SPIL session
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Session 4: Sustainability
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Session 4: Sustainable energy technologies, sustainability and policy
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Session 4: Sustainable technologies
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Session 4: System-level synthesis
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Session 4: Tracing [Breaker page]
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Session 4: Transport Protocols
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Session 4: Trust, privacy, and data security
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Session 4: validation pattern generation
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Session 4: Visual Surveillance I Presentations Selected From the Call for Papers
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Session 4: Visual Surveillance III
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Session 4: Waste management
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Session 4: Web systems design
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Session 4: Workload analysis and benchmark development [breaker page]
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Session 40 Panel: Bio-medical electronics—The scope of life science engineering
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Session 40: Cooling systems
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Session 41 Space phenomena and measurements
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Session 41: Energy saving - energy efficiency
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Session 42 Status session on theory and application of optimal control
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Session 42: Eco-design of installations and asset management
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Session 43 Microwave high power
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Session 43: Monitoring
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Session 44 Industrial electronics around the world
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Session 44: Lead acid batteries
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Session 46 Audio
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Session 47 Digital modulation
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Session 48 Bio-medical electronics
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Session 49 Nuclear instrumentation and measurements
288
Session 4A - Buffers and voltage islands
289
Session 4A - High mobility channel devices
290
Session 4a - Information assurance II
291
Session 4A ad hoc and sensor networks
292
Session 4a Motor Drives
293
Session 4A NUCA and 3-D stacked memory hierarchies
294
Session 4A Privacy, security, DOS and defences I
295
Session 4A: Developments in Timing Analysis and Optimization
296
Session 4a: Historical session
297
Session 4A: Mobile communication 1 [breaker page]
298
Session 4A: Modeling, analysis and design
299
Session 4A: Next generation network technology
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Session 4A: Next Generation Network Technology (III)
301
Session 4A: RF Circuit Design
302
Session 4A: Wireless communication technology (IV)
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Session 4A: Wireless communication technology (IV)
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Session 4A; Wireless and Ad Hoc
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Session 4B - NAND flash memory
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Session 4b - Network performance [breaker page]
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Session 4B - Sequential circuit optimization
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Session 4b Power Conditioning Applications
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Session 4B Power/performance-efficient architectures and accelerators
310
Session 4B Routing and switching I
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Session 4B: CDMA and Wireless Communications (IOV)
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Session 4B: Energy Efficiency and Interconnect Design
313
Session 4B: Innovative Technologies and Synthesis
314
Session 4B: Magnetics
315
Session 4B: Mobile communications (IV)
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Session 4B: Network management [breaker page]
317
Session 4b: Signal processing I
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Session 4B: Wideband wireless communication
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Session 4B: WiFi & WiMax networks
320
Session 4B: Wireless sensor network (IV)
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Session 4C - Power grid verification
322
Session 4C Ad hoc and sensor networks I
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Session 4C authentication techniques, IPR & copyrights
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Session 4C: Floorplanning for Advanced Technologies
325
Session 4C: Future web [breaker page]
326
Session 4C: Information Security Technology (IV): Authentication & Authority [breaker page]
327
Session 4C: IT service technology (II)
328
Session 4C: Next generation network technology (IV)
329
Session 4C: Optical networking tecnology
330
Session 4c: Radar applications
331
Session 4C; Modeling and Advanced Techniques
332
Session 4D - Nanoelectronics
333
Session 4D Peer-to-peer and overlay networking II
334
Session 4D: Digital broadcasting technology (II)
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Session 4D: Multimedia and Internet Systems and Services (IV)
336
Session 4D: Network & information security
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Session 4D: Network & information security
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Session 4D: RFID & USN technologies (IV)
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Session 4D: Robust Design Tools
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Session 4D: Wireless communication 4 [breaker page]
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Session 4E: Mobile Communications (I)
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Session 4E: Poster session (II)
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Session 4E: Telematics technology
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Session 4F: Communication network topology & planning (II)
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Session 4F: Poster Session (I)
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Session 4F: Wireless communication 8 [breaker page]
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Session 4G: Poster session (II)
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Session 4P: Poster 4 [breaker page]
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Session 5
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Session 5
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Session 5
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Session 5 - Advanced Transistor Technology I
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Session 5 - Biological Effects of Microwaves [breaker page]
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Session 5 - Broadband circuit techniques for emerging wireless communications
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Session 5 - Circuit and system integration
356
Session 5 - CIVIOS and Interconnect Reliability - NBTI Effect in Conventional and High-K Dielectrics
357
Session 5 - Component Applications of Field Theory [breaker page]
358
Session 5 - Microwave Acoustics [breaker page]
359
Session 5 - Microwave Measurements [breaker page]
360
Session 5 - Microwaves in Communication Systems [breaker page]
361
Session 5 - Multicast
362
Session 5 - New FLASH and SRAM Developments
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Session 5 — Special session: Arithmetic for image and signal processing chair: Daniel Menard, University of Rennes 1
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Session 5 ? Software reliability
365
Session 5 Abstract: Entertainment and Gaming Applications
366
Session 5 Advanced techniques in product engineering
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Session 5 B Routing and switching II
368
Session 5 C Ad hoc and sensor networks II
369
Session 5 Circuit techniques and applications
370
Session 5 Computer components
371
Session 5 Converter Modelling and Control
372
Session 5 D Quality of service I
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Session 5 Detectors, sensors and displays — Solid-state sensors and displays
374
Session 5 Device technology — Interconnects
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Session 5 Flip chip and interconnection
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Session 5 formal opening of conference / keynote address [breaker page]
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Session 5 formal opening of conference [breaker page]
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Session 5 Integrated circuits — Advanced integrated structures
379
Session 5 Integrated circuits — High speed/High density systems
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Session 5 IP piracy protection, CAD tool security and PUFs
381
Session 5 keynote addresses: Two views into the future
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Session 5 linear macromodeling I
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Session 5 Management
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Session 5 Memories
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Session 5 Memory II [breaker page]
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Session 5 microwave transistor amplifiers [breaker page]
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Session 5 millimeter-wave IMPATTS [breaker page]
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Session 5 optoelectronic technology and applications [breaker page]
389
Session 5 overview - WLAN transceivers
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Session 5 overview / analog: PLLs
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Session 5 overview digital-to-analog techniques [breaker page]
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Session 5 Overview Potpourri: PLL, optical, DSL
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Session 5 overview wireless networking transceivers [breaker page]
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Session 5 overview: Analog techniques: Analog subcommittee
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Session 5 overview: Audio and power converters: Analog subcommittee
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Session 5 overview: Processors
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Session 5 overview: RF techniques
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Session 5 Overview: WLAN Transceivers
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Session 5 Power and system integration
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Session 5 Power Semiconductor Devices
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Session 5 process control, modeling
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Session 5 Quantum electronics and energy conversion devices — Laser diodes and infrared LED´s
403
SESSION 5 Reliability
404
Session 5 Solid state devices — InP MIS structures and Josephson junctions
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Session 5 Solid state devices — Microwave GaAs MESFETs
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Session 5 Solid-state devices — Discrete power devices
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Session 5 thermal integration packaging system integration
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Session 5. Intelligent measurements systems. New approaches in measurements: Intellectual, soft and fuzzy measurements
409
Session 5.1 - FPGA architectures for specific applications
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Session 5.1 — PHM for aircraft engines
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Session 5.1 Ad hoc Networks I
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Session 5.2 - fault tolerance, test & verification
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Session 5.2 — Supportability
414
Session 5.2 Concurrent Computing
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Session 5.3 — Fault diagnosis and prognosis for gears
416
Session 5.3 EWCN Wireless Sensor Networks I
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Session 5.4 — Accelerated degradation test and reliability enhancement test
418
Session 5.5 — FMEA, FMECA, FMMEA, and FBA
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Session 5.A: Des for testability
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Session 5.B: Fault analysis and testability
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Session 5: Access control and cloud security
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Session 5: Advanced modeling, processing and inversion II
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Session 5: Applications of NNs 4: NNs in modeling
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Session 5: Architectures
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Session 5: behavioral modeling
426
Session 5: Characterization, reliability, and yield BTI in SiON and high k FETs
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Session 5: Circuit
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Session 5: Cloud computing
429
Session 5: Component Applications of Field Theory
430
Session 5: Converters and control techniques
431
Session 5: Data security
432
Session 5: Design and programming of array architectures [breaker page]
433
Session 5: Detectors & Display—Display devices
434
Session 5: Dielectrics I
435
Session 5: Distributed applications (DA)
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Session 5: Dynamic architectures & adaptive management for image & signal processing
437
Session 5: Ecosphere and industrial ecology - I
438
Session 5: Efficient design of IP multimedia blocks
439
Session 5: E-governance
440
Session 5: E-health
441
Session 5: Electronic ballast
442
Session 5: Environmental measurements
443
Session 5: E-science
444
Session 5: ESD/latchup (1)
445
Session 5: e-society
446
Session 5: E-society
447
Session 5: FPGAs and synthesis — Part II
448
Session 5: Frameworks and model transformations
449
Session 5: Hardware performance measurement [breaker page]
450
Session 5: Health care user needs
451
Session 5: Image processing applications and systems
452
Session 5: Image tiling and denoising
453
Session 5: Industry session/industry session panel
454
Session 5: Information security
455
Session 5: Information security
456
Session 5: Internet application and technology
457
Session 5: Internet applications and technology
458
Session 5: Internet security
459
Session 5: Invited session: On-chip instrumentation for silicon validation and debug
460
Session 5: Low-cost radio over fibre (RoF) solutions
461
Session 5: medical applications 1
462
Session 5: Network on chip system architecture
463
Session 5: Network security
464
Session 5: Networks And Communications
465
Session 5: Neural and fuzzy networks in prediction
466
Session 5: On-chip systems and networks
467
Session 5: Overlay Networks
468
Session 5: parallel and distributed programming tools for grids [breaker page]
469
Session 5: People in Context
470
Session 5: Power distribution system development
471
Session 5: Process characterization
472
Session 5: Real-time operating system and architecture for FPGA-based multimedia systems
473
Session 5: Reliability & electro-migration
474
Session 5: RF Noise Panel
475
Session 5: Scheduling
476
Session 5: Session 5A: Low-power IC test
477
Session 5: Smart Sensor Networks and Interfaces I
478
Session 5: Software development and application
479
Session 5: Sustainability
480
Session 5: Sustainable energy technologies
481
Session 5: System theory and control theory
482
Session 5: Test Case Generation II
483
Session 5: Test generation
484
Session 5: Ubi/Cloud computing
485
Session 5: VLSI design
486
Session 5: Web systems analysis
487
Session 50 Automatic control
488
Session 51 Microwaves
489
Session 52 Symposium on the impact of microelectronics on circuit theory
490
Session 53 Machine processing and generation of sound
491
Session 5A - Process technology
492
Session 5A - Variability in design
493
Session 5A Performance modeling and analysis
494
Session 5A Privacy, security, DOS and defences II
495
Session 5A: Embedded Tutorial: Variability Impact on Design
496
Session 5a: MIMO
497
Session 5A: Mobile communication 2 [breaker page]
498
Session 5A: next generation network technology (V)
499
Session 5A: Quasi-resonant converters
500
Session 5A: Wireless communication technology (V)
501
Session 5A: Wireless communication technology (V)
502
Session 5B - Efficient analog design space exploration techniques
503
Session 5B - PCRAM
504
Session 5B On-chip networks - II
505
Session 5B: Advanced Intelligent Network
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Session 5B: Advances in Test and Fault Tolerance
507
Session 5B: Architectural Issues in System Synthesis
508
Session 5B: Communication policy & market
509
Session 5B: Converter applications
510
Session 5B: Distributed & cloud computing [breaker page]
511
Session 5B: Mobile communications (I)
512
Session 5B: Mobile communications (V)
513
Session 5b: Signal processing II
514
Session 5C - Dynamic voltage scaling
515
Session 5C: Big data and search engine [breaker page]
516
Session 5C: Information Security Technology (V) : Privacy & P2P
517
Session 5C: Integrated Placement Applications
518
Session 5C: Mobile internet (I)
519
Session 5C: Optical networking technology (V)
520
Session 5C: Systems & software engineering (I)
521
Session 5c: UWB I
522
Session 5D - Biochips and DNA-Based nanofabrication
523
Session 5D: Intelligent Robot and Telematics Technology
524
Session 5D: Multimedia & internet systems (I)
525
Session 5D: Novel Directions in Logic Synthesis
526
Session 5D: Optical networking technology
527
Session 5D: RFID & USN technologies (V)
528
Session 5D: Wireless communication 5 [breaker page]
529
Session 5E: Mobile Communications (II)
530
Session 5E: Multimedia and internet systems, and services (I)
531
Session 5F: Information security technology (I)
532
Session 5F: Wireless communication 9 [breaker page]
533
Session 6
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Session 6
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Session 6
536
Session 6 - Advanced SoC/SiP integration & co-design
537
Session 6 - Biomedical Aspects of Microwaves [breaker page]
538
Session 6 - Computor-Aided Microwave Practices [breaker page]
539
Session 6 - High performance DACs and amplifiers
540
Session 6 - Microwave Filters and Components II [breaker page]
541
Session 6 - Millimeter Astronomy, Related Topics [breaker page]
542
Session 6 - Modeling and Simulation Transport in Nanoscale Silicon-Based FETs - I
543
Session 6 - Oversampling Converters
544
Session 6 - Strain Enhanced CMOS
545
Session 6 — Analog circuits using digital cells
546
Session 6 — Special session: Architectures for forward error correction decoders chair: Matthieu Arzel, Telecom Bretagne
547
Session 6 ? Safety modeling, simulation and optimization
548
Session 6 A Photonic switching and optical networking II
549
Session 6 Abstract: Mobile Applications in Logistics, Manufacturing and Services
550
Session 6 AC-DC
551
Session 6 Advanced material
552
Session 6 B Scheduling and resource management I
553
Session 6 C Ad hoc and sensor networks III
554
Session 6 CMOS memories [breaker page]
555
Session 6 computer aids for layout and analysis [breaker page]
556
Session 6 Converter Circuit Techniques
557
Session 6 Cryptography and securing hardware
558
Session 6 D Multicasting
559
Session 6 data acquistition circuits [breaker page]
560
Session 6 Detectors, sensors, and displays — Image sensor technology
561
Session 6 Detectors, sensors, and displays — Infrared detectors and materials
562
Session 6 Detectors, sensors, and displays — Silicon imagers and sensors
563
Session 6 Device technology — Contacts and interconnects
564
Session 6 Device technology — Insulators
565
Session 6 digital circuit techniques
566
Session 6 digital circuits [breaker page]
567
Session 6 Digital IC´s
568
Session 6 high density SRAMs [breaker page]
569
Session 6 high speed technologies
570
Session 6 Integrated circuits — Dynamic memory concepts and techniques
571
Session 6 invited frontiers of technology [breaker page]
572
Session 6 keynote address
573
Session 6 linear macromodeling II
574
Session 6 LSI logic [breaker page]
575
Session 6 LSI logic arrays
576
Session 6 LSI system components [breaker page]
577
Session 6 MOS techniques
578
Session 6 Novel materials, processes, and devices
579
Session 6 optical data links [breaker page]
580
Session 6 overview - high-speed and oversampled DACs
581
Session 6 overview / IMMD: Sensors & energy harvesting
582
Session 6 Overview Cellular and tuner
583
Session 6 overview digital circuit application of IC technology [breaker page]
584
Session 6 overview SRAM and non-volatile memories [breaker page]
585
Session 6 overview telecommunication circuit technology
586
Session 6 overview: displays & biomedical devices
587
Session 6 overview: Emerging medical and sensor technologies technology directions subcommittee
588
Session 6 overview: Image sensors and displays: IMMD subcommittee
589
Session 6 Overview: Imaging
590
Session 6 overview: Medical, displays and imagers: Imagers, MEMS, medical and displays subcommittee
591
Session 6 overview: Technologies for high-speed data networks: Technology directions subcommittee
592
Session 6 packaging
593
Session 6 Panel: Human factors in electronics—A technical status report
594
Session 6 Power Components and Protection
595
Session 6 Quantum electronics and energy conversion devices — Photovoltaics
596
SESSION 6 RF Test Structures
597
Session 6 semiconductor memory II [breaker page]
598
Session 6 Sensor networks & performance
599
Session 6 Solid state devices — Discrete power devices
600
Session 6 testing and design automation [breaker page]
601
Session 6. Environmental information systems
602
Session 6.1 — Testability modeling and design
603
Session 6.1 Ad hoc Network II
604
Session 6.2 — Decision-making & maintainability
605
Session 6.2 Web Architectures and Services
606
Session 6.3 — PHM for aircrafts
607
Session 6.3 EWCN Wireless Sensor Networks II
608
Session 6.4 — Maintainability & availability
609
Session 6.A: Signal processing
610
Session 6.B: Physical design
611
Session 6: 3D interconnection
612
Session 6: Ambient assisted living
613
Session 6: Applications of NNs 5: Robot and industry control
614
Session 6: Application-specific processors [breaker page]
615
Session 6: Biomedical Aspects of Microwaves
616
Session 6: Converters and control techniques
617
Session 6: Data Management
618
Session 6: Data mining and knowledge discovery
619
Session 6: Digital forensics
620
Session 6: Digital forensics and cyber security
621
Session 6: Distribution network as electricity market place and impact of regulation
622
Session 6: E-business
623
Session 6: E-business and new enabling technologies
624
Session 6: E-learning
625
Session 6: E-Learning
626
Session 6: Energy-aware modeling and optimization [breaker page]
627
Session 6: E-society: E-learning, e-commerce, e-business and e-government
628
Session 6: failure analysis (11)
629
Session 6: fault coverage analysis
630
Session 6: Formal verification
631
Session 6: Functional testing and verification
632
Session 6: Heterogeneous platforms
633
Session 6: High-speed/broadband microwave photonic devices
634
Session 6: Index
635
Session 6: Information security
636
Session 6: Information security
637
Session 6: Information security
638
Session 6: Intelligent solutions II
639
Session 6: Internet application and technology
640
Session 6: Measurement Technologies II
641
Session 6: Mining and geological applications
642
Session 6: Miscelaneous [breaker-page]
643
Session 6: Multimedia and web services
644
Session 6: Network architecture and protocols (NAP)
645
Session 6: New enabling technologies
646
Session 6: New enabling technologies and industrial developments
647
Session 6: Parallel implementations of HEVC and FFT for embedded multi-/manycore systems
648
Session 6: Power Engineering - II
649
Session 6: Process characterization II
650
Session 6: programming [breaker page]
651
Session 6: Quantum, power, and compound semiconductors devices - high-voltage power devices
652
Session 6: Realizations of neural networks
653
Session 6: Reliability
654
Session 6: Resource management in multicore systems
655
Session 6: RF
656
Session 6: Router architecture
657
Session 6: Session 6A: Power issues in test
658
Session 6: Signal processing and processor designs
659
Session 6: Simulation, modeling, analysis and computer applications
660
Session 6: Smart and adaptive devices
661
Session 6: Software architectures
662
Session 6: Software optimization techniques
663
Session 6: Software synthesis for multimedia applications
664
Session 6: Solid state devices: Novel diode concepts
665
Session 6: special session on environmental applications of computational intelligence 2
666
Session 6: Stochastic Modeling of QOS
667
Session 6: Sustainable energy technologies
668
Session 6: System design
669
Session 6: Transformation-based Verification
670
Session 6: Wave and turbulence measurements
671
Session 6: Wireless sensor network
672
Session 6: Yield
673
Session 6A - Efficient simulation and synthesis methodologies for analog circuits
674
Session 6A - Focus session - Design enablement I
675
Session 6a - Information Assurance III
676
Session 6A - Low-Noise Receivers [breaker page]
677
Session 6A Security, verification, and validation
678
Session 6A: Embedded Tutorial: World-Level Methods in Formal Verification
679
Session 6A: Improving Career Conditions (Panel Discussion)
680
Session 6A: Mixed Signal Systems and Hard-Sensor Electronics
681
Session 6A: Mobile communication 3 [breaker page]
682
Session 6A: Network Management
683
Session 6a: Noise radar I
684
Session 6A: Resonant converters: Analysis
685
Session 6A: Wireless communication technology (VI)
686
Session 6A: Wireless communication technology (VI)
687
Session 6B - NOvel Devices
688
Session 6B - Solid-State Power Amplifiers [breaker page]
689
Session 6b - Techniques and characterization II
690
Session 6B - Technology mapping and timing analysis
691
Session 6B processor microarchitecture - II
692
Session 6B: Defect and Fault Modelling
693
Session 6B: Digital Rome TechnologyRuby(I)
694
Session 6B: Interconnect Coding and Optimization
695
Session 6B: Mobile communications (II)
696
Session 6B: Mobile communications (VI)
697
Session 6B: Motor drives and control
698
Session 6B: System & software engineering
699
Session 6b: Tracking
700
Session 6B: Web service, social network 1 [breaker page]
701
Session 6C - Power aware system architecture and software optimizations
702
Session 6C: Converged network technology
703
Session 6C: e-government platform & framework [breaker page]
704
Session 6C: Mobile internet (II)
705
Session 6C: Multimedia & internet systems (II)
706
Session 6C: Statistical Timing Methods
707
Session 6C: System and Software Engineering
708
Session 6C: Systems & software engineering (II)
709
Session 6c: UWB II
710
Session 6D - Cellular array architectures
711
Session 6D: Broadband Internet with MPLS
712
Session 6D: Green IT technology
713
Session 6D: New Methods in Power Grid Analysis
714
Session 6D: RFID & USN technologies (VI)
715
Session 6D: Wireless communication 6 [breaker page]
716
Session 6E: Mobile Communications (III)
717
Session 6E: Multimedia and internet systems, and services (II)
718
Session 6E: Poster session (III)
719
Session 6F: Information security technology (II)
720
Session 6F: Poster Session (II)
721
Session 6F: Wireless communication 10 [breaker page]
722
Session 6G: Poster session (III)
723
Session 6P: Poster 6 [breaker page]
724
Session 6PO1: Solid state device and circuits
725
Session 6PO2: Passive devices and circuits [breaker page]
726
Session 6PO3: Computational electromagnetics [breaker page]
727
Session 6PO4: Microwave antennas [breaker page]
728
Session 6PO5: High-power devices and techniques [breaker page]
729
Session 6PO6: Smart antennas, phased and active [breaker page]
730
Session 6PP: Poster session [breaker page]
731
Session 6PP: Student paper contest
732
Session 7
733
Session 7
734
Session 7 - Advanced Interconnects
735
Session 7 - CMOS Devices - Strained Silicon I
736
Session 7 - Commercial and Industrial Application of Microwaves [breaker page]
737
Session 7 - Embedded SRAM and applications
738
Session 7 - Filters [breaker page]
739
Session 7 - High resolution converters
740
Session 7 - Highlights
741
Session 7 - Microwave Technology for Phased Arrays [breaker page]
742
Session 7 - On-Die Power Supply Integrity
743
Session 7 - Open Forum Session I [breaker page]
744
Session 7 - Professional Action [breaker page]
745
Session 7 — Advances in biomedial sensor systems
746
Session 7 (special session): Advanced image processing for space applications
747
Session 7 ? Health monitoring and others
748
Session 7 ? Quality
749
Session 7 Abstract: Government, Medicine and Education
750
Session 7 Analog Circuit from DC to VHF
751
Session 7 analog signal processing
752
Session 7 Analytical and statistical techniques in reliability analysis
753
Session 7 circuits for digital communications [breaker page]
754
Session 7 computer-aided design and device modeling [breaker page]
755
Session 7 data converters [breaker page]
756
Session 7 design aids technology limits
757
Session 7 Detectors, sensors and displays — Quantum detectors
758
Session 7 Device characteristics, modeling & simulation
759
Session 7 dynamic RAMs [breaker page]
760
Session 7 Electron tubes — Classical microwave tubes
761
Session 7 Electron tubes — Fast wave and high power devices
762
Session 7 Electron tubes — General
763
Session 7 Electron tubes — New technology, guns and codes
764
Session 7 Electron tubes — TWTs and klystrons
765
Session 7 Embedded device and IPD
766
Session 7 frequency selective circuits [breaker page]
767
Session 7 fuel cells & electric transport
768
Session 7 high speed analog circuits [breaker page]
769
Session 7 interconnect systems I
770
Session 7 LSI in consumer electronics
771
SESSION 7 Matching
772
Session 7 microwave amplifiers [breaker page]
773
Session 7 microwave analog and digital signal processors
774
Session 7 microwave FETs [breaker page]
775
Session 7 Miscellaneous
776
Session 7 nonvolatile memories [breaker page]
777
Session 7 overview - multimedia processing
778
Session 7 overview / energy-efficient digital: Multimedia & mobile
779
Session 7 overview baseband communications [breaker page]
780
Session 7 Overview DRAM
781
Session 7 overview high speed memory
782
Session 7 overview memory II/memory circuits and systems [breaker page]
783
Session 7 overview: Designing in emerging technologies
784
Session 7 overview: Image sensors: IMMD subcommittee
785
Session 7 overview: Multi-Gb/s receiver and parallel I/O techniques: Wireline subcommittee
786
Session 7 overview: Non-volatile memory solutions: Memory subcommittee
787
Session 7 overview: Optical transceivers and silicon photonics
788
Session 7 Overview: TD: Scaling Trends
789
Session 7 Quantum electronics and compound semiconductor devices — High speed compound semiconductor devices and device physics
790
Session 7 semi-custom arrays [breaker page]
791
Session 7 Solid state devices — III-V device and circuit technology
792
Session 7 solid-state microwave circuits [breaker page]
793
Session 7 transmission lines and high-speed channels II
794
Session 7. Application of decision support systems in the economy and the social sphere
795
Session 7.1 — PHM for power components and equipments
796
Session 7.1 QoS
797
Session 7.2 — Structural health monitoring - 2
798
Session 7.2 Internet Protocols
799
Session 7.3 — Maintainability
800
Session 7.3 EWCN 3G and Beyond
801
Session 7.4 — Advanced sensors & data transmission
802
Session 7: Capacitance
803
Session 7: CD Metrology
804
Session 7: Computer arithmetics and cryptography [breaker page]
805
Session 7: Data security
806
Session 7: Design techniques and methodologies chair: Michel Hübner, Ruhr-Universität Bochum
807
Session 7: Dynamic QoS control for real-time multimedia
808
Session 7: E-business
809
Session 7: E-business
810
Session 7: E-Governance
811
Session 7: Electron tubes 1—Tubes for space communication
812
Session 7: Green computing
813
Session 7: Index
814
Session 7: Industrial electronics I
815
Session 7: Information and network security
816
Session 7: Information security
817
Session 7: Information security
818
Session 7: Intelligent computing
819
Session 7: intelligent sensors
820
Session 7: invited session: high level design
821
Session 7: Lead acid batteries
822
Session 7: LED thermal solution
823
Session 7: Measurement platforms
824
Session 7: Mining production, mechanical engineering and metallurgy - II
825
Session 7: Multimedia and web services
826
Session 7: Multimedia and web services
827
Session 7: Network management (NM)
828
Session 7: Network security and e-Society
829
Session 7: Neural networks and signal processing 1
830
Session 7: Novel GPR systems and antennas
831
Session 7: P2P
832
Session 7: Parameter extraction
833
Session 7: Poster Session II
834
Session 7: Queue & Buffer Management
835
Session 7: resource sharing
836
Session 7: SAT solving approaches
837
Session 7: Scheduling II
838
Session 7: Secure technologies
839
Session 7: Secure technologies
840
Session 7: Secured transactions
841
Session 7: Sensors and health
842
Session 7: Session 7A: ATPG & compression
843
Session 7: Simulation
844
Session 7: Smart image sensors
845
Session 7: Social network
846
Session 7: Solid-state and nanoelectronic devices - spin devices, batteries and steep slope FETs
847
Session 7: Special Session II
848
Session 7: THz waves and system applications
849
Session 7: unorthodox computing architectures [breaker page]
850
Session 7: Wireless Sensors
851
Session 7a - Ad hoc networks
852
Session 7A - Variability aware clocking
853
Session 7A Transport protocols II
854
Session 7A: Advances in SAT-Based Verification
855
Session 7A: Analog Circuit Design 2
856
Session 7A: Communication network topology & planning
857
Session 7A: Communication Network Topology & Planning (I)
858
Session 7A: e-Government and e-Services 2 [breaker page]
859
Session 7a: Noise radar II
860
Session 7A: Wireless communication technology (VII)
861
Session 7A: Wireless communication technology (VII)
862
Session 7AO1: Passive devices and circuits
863
Session 7AO2: Computational electromagnetics
864
Session 7AO3: Microwave antennas
865
Session 7AO4: Scattering and propagation
866
Session 7AO5: Microwave and millimeter wave systems
867
Session 7AO6: Submillimeter wave techniques
868
Session 7AP: Poster session
869
Session 7b - IWSEEASN I International workshop on strategies for energy efficiency in ad-hoc and sensor networks I
870
Session 7B - Oscillator analysis
871
Session 7B Scheduling and resource management II
872
Session 7B: Broadband internet with MPLS
873
Session 7B: Digital Broadcasting Network
874
Session 7B: Mobile communications (III)
875
Session 7B: Mobile communications (VII)
876
Session 7b: Modelling
877
Session 7B: Power and Layout-Driven Logic Optimization
878
Session 7B: Simulation and Validation
879
Session 7B: Web service, social network 2 [breaker page]
880
Session 7C - Power noise and thermal issues
881
Session 7C Wireless and mobile networks III
882
Session 7C: Advances in Floorplanning and Placement
883
Session 7C: Broadband Convergence and Open Programming Networks (I)
884
Session 7C: Distributed computing (I)
885
Session 7C: Information and network security 3 [breaker page]
886
Session 7C: Mobile internet (III)
887
Session 7C: Systems & software engineering (III)
888
Session 7D - Nanocomputing
889
Session 7D Quality of service II
890
Session 7D: ASP, GRID and SAN Technologies (I)
891
Session 7D: Multimedia & internet systems (II)
892
Session 7D: Network management, operation and maintenance (I)
893
Session 7D: Optical networking technology (I)
894
Session 7D: Programmable Fabrics for Structured Design
895
Session 7D: Wireless communication 7 [breaker page]
896
Session 7E. Mobile Communications (IV)
897
Session 7E: Multimedia and internet systems, and services (III)
898
Session 7F: Information security technology (III)
899
Session 7F: Wireless communication 11 [breaker page]
900
Session 7PO1: Solid state device and circuits
901
Session 7PO2: Passive devices and circuits
902
Session 7PO3: Instrumentation and measurement techniques
903
Session 7PO4: Microwave antennas
904
Session 7PO5: Microwave and millimeter wave systems
905
Session 7PO6: EMI and EMC
906
Session 7PP: Poster session
907
Session 8
908
Session 8 - Characterization and test methods for device variability in nanoscale technologies
909
Session 8 - FET Amplifiers [breaker page]
910
Session 8 - Flash Memory I
911
Session 8 - Microwave Integrated Circuits [breaker page]
912
Session 8 - Multi gigabit wireline communication
913
Session 8 - Panel Discussion: Millimeter Integrated Circuit Technology
914
Session 8 - Passive Microwave Components [breaker page]
915
Session 8 - Plenary Session II
916
Session 8 - Poster
917
Session 8 - Recent Advancements in Gallium Arsenide Devices [breaker page]
918
Session 8 - Solid State Devices - Room Temperature Single Electronics and Tunneling Devices
919
Session 8 — Special session: Visual surveillance chair: Marek Gorgon, AGH University of Science and Technology [breaker page]
920
Session 8 ? Diagnosis & prognosis/prediction
921
Session 8 ?Fault diagnosis and prognosis-2
922
Session 8 3-D packaging
923
Session 8 Abstract: Emergent Theory Building in Mobile Applications and Ubiquitous Computing
924
Session 8 advances in devices and technology
925
Session 8 Analog, mixed mode, and RF
926
Session 8 computer aids for IC design and testing [breaker page]
927
Session 8 consumer electronics [breaker page]
928
Session 8 data aquisition and conversion [breaker page]
929
Session 8 DC-DC converters soft-switching
930
Session 8 Detectors, sensors and displays — Microsensor fabrication technology
931
Session 8 Detectors, sensors and displays — Technologies for integrated sensors
932
Session 8 Device technology — Novel device technology
933
Session 8 digital signal processing [breaker page]
934
Session 8 Electron tubes — Microwave tube theory and technology
935
Session 8 Electron tubes — Millimeter-wave gyrotrons
936
Session 8 fully-integrated analog filters
937
Session 8 Gunn and IMPATT diode circuits
938
Session 8 Integrated circuits — Advanced bipolar integrated circuits
939
Session 8 integrated logic circuits [breaker page]
940
Session 8 interconnect characterization
941
Session 8 linear ICs for consumer applications [breaker page]
942
Session 8 memories and redundancy techniques [breaker page]
943
Session 8 Microprocessors Peripherals and Data Processing Circuits
944
Session 8 microprocessors-Design methodology [breaker page]
945
Session 8 modeling and technology [breaker page]
946
Session 8 monolithic filters
947
Session 8 new device and circuit techniques [breaker page]
948
Session 8 new devices and techniques [breaker page]
949
Session 8 overview - circuits for high-speed links and clock generators
950
Session 8 overview / wireline: Architectures & circuits for next generation wireline transceivers
951
Session 8 overview high speed timing [breaker page]
952
Session 8 overview microwave circuits [breaker page]
953
Session 8 overview microwave subsystems and measurements
954
Session 8 Overview Multimedia processors
955
Session 8 Overview: Circuits for Digital Systems
956
Session 8 overview: Delta-sigma converters: Data converters subcommittee
957
Session 8 overview: High-speed wireline transceivers
958
Session 8 overview: Low-power digital techniques: Energy-efficient digital
959
Session 8 overview: Millimeter-wave techniques
960
Session 8 overview: Optical links and copper PHYs: Wireline subcommittee
961
SESSION 8 Poster
962
Session 8 poster session II
963
Session 8 Quantum electronics and energy-conversion devices — Silicon solar cells
964
Session 8 signal and data processing circuits [breaker page]
965
Session 8 signal processing [breaker page]
966
Session 8 Solid state devices — Advanced bipolar devices
967
Session 8 Vehicular communications
968
Session 8.1 MWN MAC and Scheduling
969
Session 8.2 WIA IA in Networks I
970
Session 8.3 EWCN Ad hoc Networks
971
Session 8: 3D vision systems and applications
972
Session 8: Application-specific architectures [breaker page]
973
Session 8: Chemical and Gas Sensing
974
Session 8: Civil engineering and geotechnical engineering - II
975
Session 8: Cloud security
976
Session 8: Concrete, pavement & material characterization
977
Session 8: coverage directed validation
978
Session 8: DC - DC converters
979
Session 8: Device technology—MOS device technology
980
Session 8: Doppler technology — Part I
981
Session 8: E-governance
982
Session 8: E-governance
983
Session 8: E-learning
984
Session 8: Emerging network technologies (ENT)
985
Session 8: failure analysis (III)
986
Session 8: FET Amplifiers
987
Session 8: Fuel cells powered systems
988
Session 8: Green PCB & PCBA I
989
Session 8: industrial applications 2
990
Session 8: Industrial developments
991
Session 8: Information security and access control
992
Session 8: infrastructure
993
Session 8: Intelligent systems
994
Session 8: Internet applications and e-technology
995
Session 8: Internet applications and information security
996
Session 8: Internet applications and technology
997
Session 8: Internet security
998
Session 8: Load Balancing
999
Session 8: Matching
1000
Session 8: MEMS
