بر اساس عنوان
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Interface coupling and film thickness measurement on thin oxide thin film fully depleted SOI MOSFETs89
Interface dissipation in piezoelectric MEMS resonators: An experimental and numerical investigation146
Interface for barge-in free spoken dialogue system based on sound field control and microphone array240
Interface Optimization of GalnAs/GalnAsP (λ=1.3μm) Superlattices by the Use of Growth Interruptions270
Interface Properties of Nanocrystalline-
294
Interface requirements of a large hydroelectric power plant with its regional load dispatch office344
Interface states and nc-Si dots induced charging/discharging effects in floating gate MOS structures355
Interface states in MOSFETs due to hot-electron injection determined by the charge pumping technique395
Interface Threat Analysis and Current Injection Testing for Direct Drive SGEMP in Multiwire Cables503
Interface-state measurement on SOS using the charge-pumping technique on gated-diode test structures507
Interface-Trap Analysis by an Optically Assisted Charge-Pumping Technique in a Floating-Body Device557
Interfacial configurations and mixing performances of fluids in staggered curved-channel micromixers587
Interfacial electronic phenomena in phthalocyanine Langmuir-Blodgett films under photo-illumination636
Interfacial Oxide Break-Up in npn Polysilicon Emitter Bipolar Transistors by Fluorine Implantation639
Interfacial oxide, grain size, and hydrogen passivation effects on polysilicon emitter transistors659
Interfacial reaction and reliability of high temperature die attach solders for power electronics662
Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering675
Interfacial reactions and bump reliability of various Pb-free solder bumps on electroless Ni-P UBMs689
Interfacial Reactions in Ni-doped SAC105 and SAC405 Solders on Ni-Au Finish during Multiple Reflows700
Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies701
Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies704
Interfacial sliding and plasticity in back-end interconnect structures of microelectronic devices716
Interfacial structure and crystallinity of YSZ thin films grown by ion beam sputtering for MFIS-FRAM718
Interfacial studies of double carbonate thermionic oxide cathodes over accelerated operational life737
Interfacing a full wave circuit approach to lumped networks and PML absorbing boundary conditions745
Interfacing a tonometer with a microcontroller to monitor diurnal intraocular pressure variations764
Interfacing CMOS electronics to biological systems: from single molecules to cellular communities868
Interfacing Solid Modeling to CAD and CAM: Data Structures and Algorithms for Decomposing a Solid921
Interference960
Interference Alignment Cancellation in Compounded MIMO Broadcast Channels With General Message Sets
FePt Films