بر اساس عنوان

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Thermal interaction of semiconductor devices in multi-chip modules
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Thermal interaction of semiconductor devices on copper clad ceramic substrates
3
Thermal interaction of semiconductor devices on copper-clad ceramic substrates
4
Thermal Interactions Between Electromigration Test Structures
5
Thermal interface material evaluation for IGBT modules under realistic power cycling conditions
6
Thermal Interface Material Resistance Measurement Apparatus
7
Thermal interface material with aligned CNT and its application in HB-LED packaging
8
Thermal Interface Materials - A Review of the State of the Art
9
Thermal interface materials based on carbon nanotubes and their thermal characterization
10
Thermal interface materials for power electronics applications
11
Thermal Interface Materials: Historical Perspective, Status, and Future Directions
12
Thermal Interface Resistance Measurements for GaN-on-Diamond Composite Substrates
13
Thermal interface void reduction techniques for direct-soldered power modules
14
Thermal interfaces based on vertically aligned carbon nanotubes : An analysis of the different contributions to the overall thermal resistance
15
Thermal interference in a 0.85 μm 8×8 two-dimensional vertical-cavity surface-emitting laser array
16
Thermal interruption capability of carbon dioxide in a puffer-type circuit breaker utilizing polymer ablation
17
Thermal interruption performance and fluctuations in high voltage gas circuit breakers
18
Thermal inversion based on separating the radiance contribution of atmosphere and land surface
19
Thermal Investigation for Multiple Chips 3D Packages
20
Thermal investigation of a battery module for work machines
21
Thermal investigation of an infrared reflow furnace with a convection fan
22
Thermal Investigation of GaN-Based Laser Diode Package
23
Thermal investigation of high power Optical Devices by transient testing
24
Thermal Investigation of Permanent-Magnet Synchronous Motor for Aerospace Applications
25
Thermal investigation of plastic-encapsulated and hermetically sealed components for automotive industry
26
Thermal investigation of the acoustic emission in polycrystalline ferrimagnets
27
Thermal investigation of the three types of NTC thermistors
28
Thermal investigations for a three-phase AC-to-DC PWM converter
29
Thermal Investigations of 3D FCBGA Packages with TSV Technology
30
Thermal investigations of solder joints used in power applications
31
Thermal investigations of the acoustic emission in polycrystalline ferrimagnets
32
Thermal ion implantation for advanced semiconductor processing
33
Thermal ionization of an aluminum surface by pulsed megagauss field
34
Thermal ions diffusion on printed circuit board
35
Thermal IR emissivity of oil films on sea surfaces at moderate winds
36
Thermal IR emissivity of oil films on sea surfaces under moderate winds
37
Thermal IR imager utilizing a thermal-to-visible transducer
38
Thermal IR imaging in trauma
39
Thermal Isolated BIPV Design Matched to A-Si Modules Behaviours
40
Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communications
41
Thermal Isolation of Encapsulated MEMS Resonators
42
Thermal isolation of high-temperature superconducting thin films using silicon wafer bonding and micromachining
43
Thermal issues in a backwafer contacted silicon-on-glass integrated bipolar process
44
Thermal Issues in LDMOSFET Packages
45
Thermal issues in MEMS and microscale systems
46
Thermal issues in microelectronics
47
Thermal issues in microelectronics
48
Thermal issues in microelectronics
49
Thermal issues in microelectronics
50
Thermal issues in microelectronics
51
Thermal issues in microelectronics
52
Thermal issues in microelectronics
53
Thermal issues in microelectronics [breaker page]
54
Thermal issues in microelectronics [breaker page]
55
Thermal Issues in Micromachined Spiral Inductors for High-Power Applications
56
Thermal issues in microsystems packaging
57
Thermal issues in next-generation integrated circuits
58
Thermal Issues in Operating Large Motors Outside Their Rated Power and Speed Range
59
Thermal issues in operating large motors outside their rated power and speed range
60
Thermal issues in stacked die packages
61
Thermal issues of solar irradiation sensor
62
Thermal joint conductance for flexible graphite materials: analytical and experimental study
63
Thermal Land Surface Emissivity Retrieved From SEVIRI/Meteosat
64
Thermal laser stimulation effects on NMOS transistor
65
Thermal Laser Stimulation of active devices in silicon - a quantitative FET parameter investigation
66
Thermal lattice Boltzmann simulations for multi-species fluid equilibration
67
Thermal lattice motion and theories of the Peierls transition
68
Thermal Layers Effect on Recording Performance in HAMR
69
Thermal Layers in Postarc Channel
70
Thermal layout optimization of stacked chips based on hybrid algorithm of simulated annealing and particle swarm
71
Thermal leakage detection on building facades using infrared textures generated by mobile mapping
72
Thermal lens and beam properties in multiple longitudinally diode laser pumped Nd:YAG slab lasers
73
Thermal lens and laser oscillating in CaF2 and BaF2 ceramics
74
Thermal Lens Compensation of Nd:YAG Rod Laser Using a Solid-state Element with Negative dn/dT
75
Thermal lens correction of Nd:YAG rod laser used with thermo-optical compensation element of solid material
76
Thermal lens effect on single-transverse-mode stability of proton-implanted photonic-crystal vertical-cavity surface-emitting lasers
77
Thermal lens effects in the LD end-pump fundamental and self-Raman crystal laser
78
Thermal lens in laser-diode-pumped self-frequency-doubled Nd,Lu:YAl/sub 3/(BO/sub 3/)/sub 4/ laser with and without laser oscillations
79
Thermal lens reduction in longitudinally pumped diffusion bonded Nd:YVO4
80
Thermal lens spectroscopy gas sensing based on etalon-stabilized wavelength sweep technique for fiber ring laser
81
Thermal lensing compensation of diode laser pumping high power Nd: YAG laser
82
Thermal lensing effect of methanol studied with femtosecond laser pulses
83
Thermal lensing in biologic medium
84
Thermal lensing in diode-pumped ytterbium Lasers-Part I: theoretical analysis and wavefront measurements
85
Thermal lensing in diode-pumped ytterbium Lasers-Part II: evaluation of quantum efficiencies and thermo-optic coefficients
86
Thermal lensing in end-pumped Nd:YAG under lasing and nonlasing conditions
87
Thermal lensing in high-power ridge-waveguide lasers
88
Thermal lensing in Nd:YVO4 laser with in-band pumping at 914 nm
89
Thermal lensing in oxide-confined, single-mode VCSELs
90
Thermal Lensing Spectroscopy Analysis of Er:YAG Crystal Rod: Thermal Focal Length Measure
91
Thermal lensing with acentric beams in thin windows
92
Thermal life evaluation of high temperature insulation systems and hybrid insulation systems in mineral oil
93
Thermal life of enameled magnet wire
94
Thermal life of enameled round magnet wire with various twist holder configurations
95
Thermal life of PVC insulated appliance hookup wires
96
Thermal life of varnished glass cloth
97
Thermal Life of Varnished Glass Cloth
98
Thermal light cannot be represented as a statistical mixture of pulses
99
Thermal limitations due to semiconductors and packaging in high power switches
100
Thermal limitations in air-cooled axial flux in-wheel motors for urban mobility vehicles: A preliminary analysis
101
Thermal limitations in optical recording
102
Thermal limitations in optical recording
103
Thermal limitations of CW and pulsed silicon TRAPATT diodes
104
Thermal limitations of InP HBT´s in 80 and 160 Gbits-1 IC´s
105
Thermal limitations of InP HBTs in 80- and 160-gb ICs
106
Thermal limitations on the performance of GaAs low boundary field oscillators
107
Thermal limits for integration of directly modulated lasers with driver IC on SOI
108
Thermal limits in reflow soldering process
109
Thermal limits of flip chip package-experimentally validated, CFD supported case studies
110
Thermal Limits of Transrormers for Short-Circuit Conditions AIEE Committee Report
111
Thermal load analysis and real time hot spots recognition in TOKAMAK using cellular nonlinear networks
112
Thermal load boards — another thermal management design tool
113
Thermal load on DED target plates
114
Thermal Loading Affecting the Measurements of Thermally Induced Focal Length
115
Thermal loading and heat removal from a sequentially fired railgun
116
Thermal Loading and Lifetime Estimation for Power Device Considering Mission Profiles in Wind Power Converter
117
Thermal loading and reliability of 10 MW multilevel wind power converter at different wind roughness classes
118
Thermal Loading and Reliability of 10-MW Multilevel Wind Power Converter at Different Wind Roughness Classes
119
Thermal loading in highly efficient diode pumped ytterbium doped lithium niobate lasers
120
Thermal Loading of Thin Metal Foils Used as Electron Beam Windows for a Krf Laser
121
Thermal loading of wind power converter considering dynamics of wind speed
122
Thermal localization
123
Thermal logic circuits
124
Thermal longevity of nano-multilayer magnetic media
125
Thermal loss and soldering effect study of high-Q antennas in handheld devices
126
Thermal loss becomes an issue for narrow-band tunable antennas in fourth generation handsets
127
Thermal loss in high-Q antennas
128
Thermal loss measurements of high frequency planar transformers
129
Thermal loss of high-Q antennas in Time Domain vs. Frequency Domain Solver
130
Thermal Lowering of the Threshold for Microwave Breakdown in Air-Filled Waveguides
131
Thermal macro-modeling of a surface mounted package with a computational fluid dynamic (CFD) tool
132
Thermal magnetic fluctuations in plasmas near the electron cyclotron frequency
133
Thermal Magnetic Noise From Synthetic Antiferromagnets in Magnetoresistive Heads
134
Thermal magnetic noise in tunneling readers
135
Thermal magnetization noise in spin valves
136
Thermal magnetization noise, damping fundamentals, and mode analysis: application to a thin film GMR sensor
137
Thermal magnetization rotation of small nanoparticles
138
Thermal magnetoresistance of copper matrix in compound superconductors, a new measuring method
139
Thermal management analysis of high-power electronic modules using Cu bonded AlN substrates
140
Thermal management and characterization of flip chip BGA packages
141
Thermal management and characterization of the active component embedding into organic substrate
142
Thermal management and concurrent system design of a wearable multicomputer
143
Thermal management and design aspects of high performance plastic quad flat packages for smart-power ICs
144
Thermal management and device failure assessment of high-power AlGaN/GaN HFETs
145
Thermal Management and Load Control of Container Data Center: A Case Study of Cloud Computing in a Rack
146
Thermal management and novel package design of high power light-emitting diodes
147
Thermal management and power packaging for spacecraft of the next millennium
148
Thermal management and resistive rail heating of a large-scale naval electromagnetic launcher
149
Thermal management and resistive rail heating of a large-scale naval electromagnetic launcher
150
Thermal management and testing of MCM with embedded chip in silicon substrate
151
Thermal management and thermal resistance of high power LEDs
152
Thermal management and thermomechanical optimization at higher temperatures
153
Thermal management aspects of all-electric ships
154
Thermal management challenges in forced convection tablets
155
Thermal Management Challenges in Telecommunication Systems and Data Centers
156
Thermal management challenges in the passive cooling of handheld devices
157
Thermal management coatings via combustion chemical vapor deposition (CCVD)
158
Thermal management concept for next generation vehicles
159
Thermal Management Concepts for Power Sandwich Industrial Drive
160
Thermal management concepts for vehicles of next generation
161
Thermal management consumption and its effect on remaining range estimation of electric vehicles
162
Thermal management control without overshoot using combinations of boiling liquids
163
Thermal management control without overshoot using combinations of boiling liquids
164
Thermal management design criteria and solutions
165
Thermal management design criteria and solutions
166
Thermal management design for GMR head ESD-robustness
167
Thermal management design for GMR head ESD-robustness
168
Thermal management design of battery compartments of outdoor telecommunication cabinets
169
Thermal management details and their influence on the aging of power semiconductors
170
Thermal management during stalled rotor by conduction loss redistribution
171
Thermal management estimations for buried bump interconnection technology printed wiring boards with bump (filled via) interconnection
172
Thermal Management for 3D Processors via Task Scheduling
173
Thermal management for ceramic multichip modules: experimental program
174
Thermal management for dependable on-chip systems
175
Thermal Management for Efficiency Enhancement for Multi-Stack Fuel Cell Electric Vehicle
176
Thermal management for flip-chip high power amplifiers utilizing carbon nanotube bumps
177
Thermal management for high performance computing in spaceborne applications
178
Thermal management for high performance integrated circuits with non-uniform chip power considerations
179
Thermal management for high-power active amplifier arrays
180
Thermal Management for High-Power Single-Frequency Tunable Diode-Pumped VECSEL Emitting in the Near- and Mid-IR
181
Thermal management for high-power wavelength conversion
182
Thermal management for motor
183
Thermal management for multifunctional structures
184
Thermal management for multifunctional structures [spacecraft electronics]
185
Thermal management for multi-phase current mode buck converters
186
Thermal management for stackable packages with stacked ICs
187
Thermal Management for Stacked 3D Microelectronic Packages
188
Thermal management for wafer level packaging (WLP)
189
Thermal management I (organized by CIPS) thermal management II (organized by CIPS)
190
Thermal Management in 2.3- μm Semiconductor Disk Lasers: A Finite Element Analysis
191
Thermal Management in a 3D-PCB-Package with Water Cooling
192
Thermal management in color variable multi-chip led modules
193
Thermal Management in Embedded Systems: A Software Approach
194
Thermal management in heat assisted magnetic recording
195
Thermal Management in Heat-Assisted Magnetic Recording
196
Thermal Management in Heat-Assisted Magnetic Recording
197
THERMAL MANAGEMENT IN HIGH AVERAGE POWER PULSED COMPRESSION SYSTEMS
198
Thermal management in high layer count PCBs using sintered-paste-filled PTH
199
Thermal management in high performance computers by use of heat Pipes and vapor chambers, and the challenges of global warming and environment
200
Thermal management in high-density power converters
201
Thermal management in high-power continuous-wave second harmonic generation
202
Thermal management in high-power vertical-external-cavity surface-emitting lasers
203
Thermal management in hybrid silicon lasers
204
Thermal Management in Large Bi2212 Mesas Used for Terahertz Sources
205
Thermal Management in Long-Wavelength Flip-Chip Semiconductor Disk Lasers
206
Thermal management in mobile devices: challenges and solutions
207
Thermal management in PowerPC microprocessor multichip modules applications
208
Thermal management in semiconductor device packaging
209
Thermal management in strongly non-planar microwave HBTs
210
Thermal management in telecommunications central offices: The next steps
211
Thermal management in the design process of MV GIS
212
Thermal management in traction applications as a constraint optimal control problem
213
Thermal management in vertical-external-cavity surface-emitting lasers: finite-element analysis of a heatspreader approach
214
Thermal management integration for microfluidics applications
215
Thermal management issues and evaluation of a novel, flexible substrate, 3-dimensional (3-D) packaging concept
216
Thermal management issues in cryo-electronics
217
Thermal management issues in Laser diode packaging
218
Thermal management issues with various space nuclear power alternatives on SSTS spacecraft
219
Thermal management of 3D IC integration with TSV (through silicon via)
220
Thermal management of 3-D IC using carbon nanotube thermal via
221
Thermal management of 3D RF PoP based on ceramic substrate
222
Thermal management of 3D stacked dies with air convection and water cooling methods
223
Thermal management of a 3D chip stack using a liquid interface to a synthetic jet cooled spreader
224
Thermal management of a C4/CBGA interconnect technology for a high-performance RISC microprocessor: the Motorola PowerPC 620TM microprocessor
225
Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603TM and PowerPC 604TM RISC microprocessors
226
Thermal management of a high-performance multichip module
227
Thermal management of a laptop computer with synthetic air microjets
228
Thermal management of a low-cost 2kW solar inverter
229
Thermal management of a medical device using thermoelectric coolers
230
Thermal management of a micro-display engine assembly
231
Thermal management of a multi-core master processing unit (MPU) for an ultrascalable computing platform
232
Thermal management of a passively cooled LED-based large area direct backlight for LCDs
233
Thermal Management of a Soft Starter: Transient Thermal Impedance Model and Performance Enhancements Using Phase Change Materials
234
Thermal Management of a Stacked-Die Package in a Handheld Electronic Device Using Passive Solutions
235
Thermal management of a stacked-die package in a handheld electronic device using passive solutions
236
Thermal management of AC induction motors using computational fluid dynamics modeling
237
Thermal Management of Active Electronically Scanned Array Transmit/Receive LRU (Line Replaceable Unit)
238
Thermal management of active LEDs in consumer TV LED-LCD display
239
Thermal Management of advanced Fuel Cell Power Systems
240
Thermal Management of Air- and Liquid-Cooled Multichip Modules
241
Thermal management of air-core stator for a large-capacity HTS motor
242
Thermal management of AlGaN-GaN HFETs on sapphire using flip-chip bonding with epoxy underfill
243
Thermal management of an electronical device using PCM embedded in a pin fin heat sink
244
Thermal management of an IGBT module using two-phase cooling
245
Thermal management of an integrated power module with multiple power devices
246
Thermal management of an led light engine for airborne applications
247
Thermal management of batteries using a hybrid supercapacitor architecture
248
Thermal management of battery compartments of outdoor telecommunication cabinets using phase change materials (PCM)
249
Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material
250
Thermal management of biomaterials in a rectangular cavity surrounded by a phase change material
251
Thermal management of BioMEMS
252
Thermal management of BioMEMS: temperature control for ceramic-based PCR and DNA detection devices
253
Thermal Management of Biosensor Networks
254
Thermal Management of Blocks in a Channel Using Phase Change Material
255
Thermal Management of Bright LEDs for Automotive Applications
256
Thermal management of compact SMT multilayer power converters
257
Thermal management of die stacking architecture that includes memory and logic processor
258
Thermal management of Diesel Engine ECU
259
Thermal Management of Digital Switching Systems
260
Thermal management of diode laser arrays
261
Thermal management of electrical machines [breaker page]
262
Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing
263
Thermal management of electronic and electrical devices in automobile environment
264
Thermal management of electronic components using Makrolon polycarbonate and Bayflex polyurethane
265
Thermal management of electronic networks using TLM
266
Thermal management of electronics enclosures under unsteady heating/cooling conditions using phase change materials (PCM)
267
Thermal Management of Electronics Using PCM-Based Heat Sink Subjected to Cyclic Heat Load
268
Thermal management of electronics: problems and analytical techniques
269
Thermal management of electronics: problems and analytical techniques
270
Thermal management of embedded device package
271
Thermal management of embedded devices
272
Thermal management of FET devices using graphene heat spreader
273
Thermal management of FPGA-based embedded systems at operating system level
274
Thermal management of fuel cell-driven vehicles using HT-PEM and hydrogen storage
275
Thermal management of GEO satellite communication payload
276
Thermal management of harsh-environment electronics
277
Thermal management of heat spreader materials for flip chip type package
278
Thermal management of high density power servers using a compact two-phase loop cooling system
279
Thermal Management of High Density Very Low Profile Memory Module
280
Thermal management of high energy density battery equipments
281
Thermal management of high performance microprocessors in burn-in environment
282
Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling
283
Thermal management of high power LEDs: Impact of die attach materials
284
Thermal management of high power memory module
285
Thermal management of high power transformer in different outdoor environment conditions
286
Thermal management of high-power electronics modules packaged with interconnected parallel plates
287
Thermal Management of High-power White LED Package
288
Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices
289
Thermal management of hotspots using upstream laminar micro-jet impinging array
290
Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices
291
Thermal Management of Hybrid Silicon Ring Lasers for High Temperature Operation
292
Thermal management of integrated circuits in burn-in environment
293
Thermal management of lateral GaN power devices
294
Thermal management of liquid-cooled cold plates for multiple heat sources in a humanoid robot
295
Thermal management of lithium-ion battery pack with liquid cooling
296
Thermal Management of Long-Length HTS Cable Systems
297
Thermal management of manycore systems with silicon-photonic networks
298
Thermal management of microelectronics in the 21st century
299
Thermal management of mid-infrared (IR) quantum cascade lasers
300
Thermal management of military fighter aircraft electro-optics pod: an invited paper
301
Thermal Management of Mobile Phone using Phase Change Material
302
Thermal management of MOSFET junction temperature in RF amplifier
303
Thermal management of multichipmodule (MCM) using genetic algorithms
304
Thermal Management of Near-Infrared Semiconductor Disk Lasers With AlGaAs Mirrors and Lattice (Mis)Matched Active Regions
305
Thermal management of on-chip caches through power density minimization
306
Thermal Management of On-Chip Caches Through Power Density Minimization
307
Thermal management of on-chip hot spots and 3D chip stacks
308
Thermal management of optically pumped long-wavelength InP-based semiconductor disk lasers
309
Thermal management of packaged IC by experimentally verified finite element modeling
310
Thermal management of packages with 3D die stacking
311
Thermal management of portable electronic equipment using thermoelectric energy conversion
312
Thermal management of portable micro fuel cell stacks
313
Thermal management of power electronics modules via acoustic micrography imaging
314
Thermal management of power electronics using thermoelectric coolers
315
Thermal management of power HBT in pulsed operating mode
316
Thermal management of power HBT in pulsed operating mode
317
Thermal Management of Power Inverter Modules at High Fluxes via Two-Phase Spray Cooling
318
Thermal management of power LED system
319
Thermal management of power system design by computational simulation
320
Thermal management of projection displays
321
Thermal management of silicon carbide power module for military hybrid vehicles
322
Thermal management of silicon-based multichip modules
323
Thermal management of surveillance equipments electronic components using pulsating heat pipes
324
Thermal management of telecommunication optical module in forced convection mode
325
Thermal management of telecommunications batteries using phase change materials (PCM) JacketTM
326
Thermal management of value regulated lead-acid batteries-a comparison of gelled vs. absorbed electrolyte technologies
327
Thermal management of VCSEL-based optoelectronic modules
328
Thermal management of VCSEL-based optoelectronic modules
329
Thermal management of vertical gallium nitride nanowire arrays: Cooling design and tip temperature measurement
330
Thermal management solutions and design guidelines for silicon based photonic integrated modules
331
Thermal Management Strategies for Cold Start of Automotive PEMFC
332
Thermal management strategies for high power semiconductor pump lasers
333
Thermal management strategies for high power semiconductor pump lasers
334
Thermal management system for high performance PowerPC/sup TM/ microprocessors
335
Thermal Management System for Particle Sensors Design, Performance and Verification
336
Thermal management system for reflow oven
337
Thermal management systems for data centers with liquid cooling technique of CPU
338
Thermal management systems´ design methodology for transport applications
339
Thermal Management Technique Using Control of Thermal Radiation Spectrum for Encapsulated Electronic Devices
340
Thermal management techniques for an advanced linear motor in an electric aircraft recovery system
341
Thermal Management Technologies for Electronic Packaging: Current Capabilities and Future Challenges for Modelling Tools
342
Thermal management technologies for electronics based on multiwalled carbon nanotube bundles
343
Thermal management technology for series-parallel HEV
344
Thermal Management through In-Board Heat Pipes Manufactured using Printed Circuit Board Multilayer Technology
345
Thermal management to avoid the collapse of current gain in power heterojunction bipolar transistors
346
Thermal management using "dry" phase change material
347
Thermal management using a hypervapotron, part III: Summary of controlling parameters
348
Thermal management using interleaved CVD diamond layers for high power 3D chip stacks
349
Thermal management using synthetic jet ejectors
350
Thermal management via task scheduling for 3D NoC based multi-processor
351
Thermal management with additive multilayer circuitry on metal substrates
352
Thermal management with diamond
353
Thermal management with graphene lateral heat spreaders: A feasibility study
354
Thermal management: A key point for the integration in solid state lighting systems
355
Thermal management: Effect of heat shielding using thin metal cylinders on a dispenser cathode temperature
356
Thermal management: Effect of heater geometry on a dispenser cathode temperature
357
Thermal management: Use of aluminum-nitride multilayer heaters in dispenser cathodes
358
Thermal Managements for Highly Efficient SHG with Linear Input/Output Characteristics Using Periodically Poled Stoichiometric LiTaO3
359
Thermal managerment of high power memory module for server platforms
360
Thermal mangament of multicore processors using power multiplexing
361
Thermal mapping of Delphi thermal test dies
362
Thermal mapping of interconnects subjected to brief electrical stresses
363
Thermal Mapping of Power Devices with a Completely Automated Thermoreflectance Measurement System
364
Thermal mapping of transistors with a laser scanner
365
Thermal Maps of GaAs P-HEMT: A Novel System Based on the Photocurrent Spectral Analysis
366
Thermal mark characterization on static magneto-optic metals
367
Thermal mark characterization on static magneto-optical media
368
Thermal mass characterization of a server at different fan speeds
369
Thermal mastering of MV/LV prefabricated substation
370
Thermal matching designed CMOS mems-based thermoelectric generator for naturally cooling condition
371
Thermal matching of a thermoelectric energy harvester with the environment and its application in wearable self-powered wireless medical sensors
372
Thermal Material With Low Curie Temperature in a Thermally Actuated Superconducting Flux Pump System
373
Thermal mathematical model correlation of an earth observation satellite
374
Thermal Measurement and Modeling of Multi-Die Packages
375
Thermal Measurement and Simulation of 3D stacked die packages
376
Thermal measurement method for multi-chip packages
377
Thermal measurement of AC power in comparison with the electrodynamic method
378
Thermal measurement of cerebrospinal fluid flow rate in hydrocephalus shunt
379
Thermal measurement of losses of GaN power transistors for optimization of their drive
380
Thermal measurement of RF and microwave devices using a novel thermal probe
381
Thermal measurements and analysis of flip-chip LED packages with and without underfills
382
Thermal Measurements and Qualification IC Packages Using the Transient Method: Principles and Applications
383
Thermal measurements and simulations with a silicon detector-pyrolytic graphite sandwich
384
Thermal measurements by use of a SBIMOS diode matrix
385
Thermal measurements for service life estimations of high power induction hardening coils
386
Thermal Measurements In A 1200 kV Compressed Gas Insulated Transmission Line
387
Thermal measurements of two layered thin films of different orders on copper
388
Thermal measurements on cooling lava
389
Thermal measurements on flip-chipped system-on-chip packages with heat spreader integration
390
Thermal mechanical modeling and assessment for a novel power system module with vertical input capacitor
391
Thermal mechanical noise based characterization of CMUTs using monolithically integrated low noise receiver electronics
392
Thermal mechanical performance test on suspended insulators for transmission line
393
Thermal mechanical study of mini-TWT ceramic jacketed collectors
394
Thermal Memory Effect in Polymer Optical Fibers
395
Thermal memory effect modeling and compensation for GaN Doherty amplifier
396
Thermal memory effects modeling and compensation in RF power amplifiers and predistortion linearizers
397
Thermal method of gas separation with micro-pores
398
Thermal method of remote sensing for prediction and monitoring earthquake
399
Thermal methodology for evaluating the performance of microelectronic devices with non-uniform power dissipation
400
Thermal methods [of blood flow imaging]
401
Thermal Metrology of Silicon Microstructures Using Raman Spectroscopy
402
Thermal metrology of silicon microstructures using Raman spectroscopy
403
Thermal metrology techniques for UV LED light sources
404
Thermal micro flow sensor
405
Thermal microactuators for optical purpose
406
Thermal micromagnetic model with a pseudo-three-dimensional junction for magnetoresistive heads
407
Thermal Microphotonic Focal Plane Array (TM-FPA) for Uncooled High Sensitivity Thermal Imaging
408
Thermal microscopy of spin-valve and magnetoresistive devices
409
Thermal microtransducers by CMOS technology combined with micromachining
410
Thermal Microwave Emission from a Three-Layer Random Medium with Three-Dimensional Variations
411
Thermal Microwave Emission from Vegetated Fields: A Comparison between Theory And Experiment
412
Thermal microwave foldover and bistability in ferromagnetic resonance
413
Thermal microwave phonons
414
Thermal mismatch induced reliability issues for Cu filled through-silicon vias
415
Thermal mitigation for high energy density metallized polypropylene capacitors when repetitively discharging
416
Thermal mitigation using thermal through silicon via (TTSV) in 3-D ICs
417
Thermal Modal Analysis of Wing Considering Aerodynamic Heating
418
Thermal model and analysis of wound rotor induction machine
419
Thermal Model and Analysis of Wound-Rotor Induction Machine
420
Thermal model and associated novel approach for synchrotron radiation liner with end cooling
421
Thermal Model and Behavior of a Totally-Enclosed-Water-Cooled Squirrel-Cage Induction Machine for Traction Applications
422
Thermal model and temperature control of a 30 MVA distribution transformer applied in low frequency drying process
423
Thermal model based digital relaying algorithm for induction motor protection
424
Thermal Model Design and Analysis of High-Power LED Headlamp Cooling Device Based on the Thermoelectric Effect
425
Thermal Model Extraction of GaN HEMTs for Large-Signal Modeling
426
Thermal model for AlGaN/GaN HEMTs including self-heating effect and non-linear polarization
427
Thermal model for data centre cooling
428
Thermal Model for Hand-Object Interactions
429
Thermal model for induction machine
430
Thermal model for operation of arc furnace transformer in steel making plant in a climate of high humidity
431
Thermal model for optical fiber coating under tight bending diameters
432
Thermal model for paralleled surface-mount power MOSFETs
433
Thermal model for power transformers dynamic loading
434
Thermal Model For The Hyperthermia Treatment Of An Irregularly Shaped Tumor
435
Thermal model for the local microwave hyperthermia treatment of benign prostatic hyperplasia
436
Thermal model generalization of infrared radiation sensors
437
Thermal model identification of a claw pole generator by a method combining FEM with experiment
438
Thermal model of a disk coil with directed oil flow
439
Thermal model of airships and its computing analysis with improved net heat method
440
Thermal model of an induction generator in oscillating water column wave energy converter
441
Thermal Model of Electrical Contacts Based on Experimental Data
442
Thermal model of electromechanical flywheel with brushless DC machine
443
Thermal model of IGBT modules in the arm converter
444
Thermal model of laser diode arrays
445
Thermal Model of Miniaturized Schottky Emitter for Parallel Electron Beam Lithography
446
Thermal model of MV cable termination using finite elements technique
447
Thermal model of permanent-magnet synchronous motor based on support vector machine and fuzzy modeling
448
Thermal model of phosphor self-heating in phosphor-converted light-emitting diodes
449
Thermal model of power semiconductor devices for electro-thermal circuit simulations
450
Thermal model of skin-equivalent phantoms at 60 GHz
451
Thermal model of stator slot for small synchronous reluctance machine
452
Thermal model of the dishwasher heater in air
453
Thermal model of the evolution of fragments inside a microscopic spot: A multiscale approach of the interaction plasma/cathode
454
Thermal model of totally enclosed water-cooled permanent magnet synchronous machines for electric vehicle applications
455
Thermal Model of Totally Enclosed Water-Cooled Permanent-Magnet Synchronous Machines for Electric Vehicle Application
456
Thermal model requirements for prediction of facet temperature in electro-optical-thermal simulation of ridge lasers
457
Thermal Model With Winding Homogenization and FIT Discretization for Stator Slot
458
Thermal modeling accuracy of hourly averaged data for large free Field Cadmium telluride PV arrays
459
Thermal modeling analysis of the IGBT integration shunt model
460
Thermal Modeling and Analysis for 3-D ICs With Integrated Microchannel Cooling
461
Thermal modeling and analysis for Ceramic Quad Flat No-lead packages
462
Thermal Modeling and Analysis of a Double-Stator Switched Reluctance Motor
463
Thermal modeling and analysis of a power device heat sinks
464
Thermal modeling and analysis of high power semiconductor laser arrays
465
Thermal modeling and analysis of pin grid arrays and multichip modules
466
Thermal modeling and analysis of storage systems
467
Thermal Modeling and Characterization of a Thin-Film Heater on Glass Substrate for Lab-on-Chip Applications
468
Thermal modeling and characterization of electrical machines, and calculation of current ratings
469
Thermal modeling and characterization of Package with Through-Silicon-Vias (TSV) Interposer
470
Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions
471
Thermal modeling and characterization of the embedded micro wafer level package (EMWLP) at the package- and system-level
472
Thermal modeling and control limits in high performance microprocessors
473
Thermal modeling and control of rapid thermal processing systems
474
Thermal modeling and design of 3D integrated circuits
475
Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages
476
Thermal Modeling and Device Noise Properties of 3D-SOI Technology
477
Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology
478
Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies
479
Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies
480
Thermal modeling and experimental study of 3D stack package with hot spot consideration
481
Thermal modeling and experimental techniques for microwave bipolar devices
482
Thermal modeling and experimental techniques for microwave bipolar devices
483
Thermal modeling and experimental validation of a large prismatic Li-ion battery
484
Thermal modeling and experimental validation of an encapsulated busbars system
485
Thermal modeling and experimental validation of thermal interface performance between non-flat surfaces
486
Thermal modeling and experimentation to determine maximum power capability of SCR´s and thyristors
487
Thermal modeling and management in ultrathin chip stack technology
488
Thermal Modeling and Management of DRAM Systems
489
Thermal modeling and management of the integrated HID ballast
490
Thermal modeling and measurement of AlGaN/GaN FETs built on sapphire and SiC substrates
491
Thermal modeling and measurement of AlGaN-GaN HFETs built on sapphire and SiC substrates
492
Thermal modeling and measurement of GaN-based HFET devices
493
Thermal modeling and measurements of AlGaN/GaN HEMTs including Thermal Boundary Resistance
494
Thermal modeling and optimization for electronic packages
495
Thermal modeling and performance of high heat flux SOP packages
496
Thermal modeling and real time overload capacity prediction of overhead power lines
497
Thermal modeling and simulation of a package-on-package embedded micro wafer level package (EMWLP) structure at the package and system-level
498
Thermal modeling and simulation of distribution transformers
499
Thermal modeling and simulation of the chilled water system for future all electric ship
500
Thermal modeling and simulation of transformers
501
Thermal Modeling and Temperature Driven Placement for FPGAs
502
Thermal Modeling and Validation of a Lithium-Ion Battery Based on Electric Vehicle Measurements
503
Thermal modeling applications to forest canopies
504
Thermal modeling as a tool to determine the overload capability of electrical machines
505
Thermal modeling for 3D-ICs with integrated microchannel cooling
506
Thermal Modeling for a HVAC Controlled Real-Life Auditorium
507
Thermal modeling for advanced high power packaging development and on-line performance monitoring
508
Thermal modeling for electrothermal simulation of power devices or circuits
509
Thermal modeling for FinFET NAND gate circuits using a multi-block reduced-order model
510
Thermal modeling for magnetic components: a survey
511
Thermal modeling for mode-size estimation in microlasers with application to linear arrays in Nd:YAG and Tm,Ho:YLF
512
Thermal modeling for MRI-guided radiofrequency tumor ablation
513
Thermal modeling for power MOSFETs in DC/DC applications
514
Thermal modeling for Silicon-on-Sapphire (SOS) based power amplifier design in wireless communication
515
Thermal Modeling for System-in-a-Package Based on Embedded Chip Structure
516
Thermal modeling for the design and check of an axial flux PM motor
517
Thermal modeling for the estimation of energy losses from municipal heating networks using infrared thermography
518
Thermal modeling for vehicle battery system: A brief review
519
Thermal modeling for warpage effects in organic packages
520
Thermal Modeling Improvements using substrate ECAD integration
521
Thermal modeling in cylindrical coordinates using effective conductivity
522
Thermal modeling methodology for efficient system-level thermal analysis
523
Thermal modeling of "direct lamination cooling (DLC)" induction motor for hybrid electric vehicle applications
524
Thermal Modeling of 3-D Stacked DRAM Over SiGe HBT BiCMOS CPU
525
Thermal modeling of 3D stacks for floorplanning
526
Thermal modeling of a BLDC motor for a kick scooter
527
Thermal Modeling of a Claw-Pole Electrical Generator: Steady-State Computation and Identification of Free and Forced Convection Coefficients
528
Thermal modeling of a double-neck large diameter crystal growth process
529
Thermal modeling of a double-neck large diameter crystal growth process
530
Thermal modeling of a few-chip module housing a DC-DC power supply
531
Thermal modeling of a high-speed switched reluctance machine with axial air-gap flow for vacuum cleaners
532
Thermal Modeling of a LiFePO4/Graphite Battery and Research on the Influence of Battery Temperature Rise on EV Driving Range Estimation
533
Thermal Modeling of a Multilayered Film via Taylor Series Expansion- and Least Squares-Based-Lattice Boltzmann Method
534
Thermal modeling of a permanent magnet machine built using Litz wire
535
Thermal Modeling of a Segmented Stator Winding Design
536
Thermal modeling of a short-duty motor
537
Thermal modeling of a small extreme power density macro on a high power density microprocessor chip in the presence of realistic packaging and interconnect structures
538
Thermal modeling of a stator bar - Influence of geometry and material properties
539
Thermal modeling of a wafer in a rapid thermal processor
540
Thermal modeling of active embedded chip into high density electronic board
541
Thermal modeling of aluminum electrolytic capacitors
542
Thermal modeling of an induction machine through the association of two numerical approaches
543
Thermal Modeling of an Induction Motor
544
Thermal Modeling of an Inverted-Type Oil-Immersed Current Transformer
545
Thermal modeling of axial piston pump and application
546
Thermal modeling of BOX/DTI enclosed power devices with Green´s function approach
547
Thermal Modeling of Brushless DC Motor and Brake Solenoid in Electro-Mechanical Actuators for the More Electric Aircraft Engine
548
Thermal modeling of cryogenic accelerator structures
549
Thermal modeling of densely packed electronic systems
550
Thermal modeling of diamond-based power electronics packaging
551
Thermal Modeling of Directly Cooled Electric Machines Using Lumped Parameter and Limited CFD Analysis
552
Thermal modeling of directly-oil-cooled permanent magnet synchronous machine
553
Thermal modeling of discrete microelectronic elements within three-dimensional continuous models
554
Thermal modeling of double slope wick-type solar still with different thickness insulation absorption of wick surface
555
Thermal modeling of double slope wick-type solar still with different thickness insulation absorption of wick surface
556
Thermal modeling of electrical contacts in switches and relays
557
Thermal modeling of electrical contacts in switches and relays
558
Thermal modeling of electrical utility transformer
559
Thermal modeling of electronic components for thermal simulation of electronic equipment
560
Thermal modeling of enhancement LED package
561
Thermal modeling of E-type magnetic components
562
Thermal Modeling of Flooded Rotor Electrical Machines for Electro-Hydrostatic Actuators
563
Thermal Modeling of Gaseous Helium as a Cryogen for High Temperature Superconducting Cable Components
564
Thermal modeling of grease-type interface material in PPGA application
565
Thermal Modeling of Helium Cooled High-Temperature Superconducting DC Transmission Cable
566
Thermal modeling of high frequency GaN power HEMT´s using analytic approach
567
Thermal modeling of high performance packages in portable computers
568
Thermal modeling of high performance packages in portable computers
569
Thermal Modeling of High Power GaN-on-Diamond HEMTs Fabricated by Low-Temperature Device Transfer Process
570
Thermal modeling of high temperature power conversion capacitors
571
Thermal modeling of homogeneous embedded multi-core processors
572
Thermal modeling of hybrid concentrating PV/T collectors with tree-shaped channel networks cooling system
573
Thermal modeling of hybrid microelectronics
574
Thermal modeling of integrated power electronic modules by a lumped-parameter circuit approach
575
Thermal Modeling of Intersubband Transition-Based InGaAs/AlAsSb Ultrafast All-Optical Cross-Phase Modulators
576
Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection
577
Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection
578
Thermal modeling of large-area VCSELs under optical pumping
579
Thermal modeling of Lundell alternators
580
Thermal modeling of Lundell alternators
581
Thermal modeling of magnetoresistive heads in three dimensions
582
Thermal modeling of medium voltage cable terminations under square pulses
583
Thermal modeling of metal oxides for highly scaled nanoscale RRAM
584
Thermal modeling of microelectronic equipment taking into account thermal contact conductance
585
Thermal modeling of micro-hotplates for integrated sensor applications
586
Thermal Modeling of Multi-Core Processors
587
Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition
588
Thermal Modeling of Multi-finger SiC Power MESFETs
589
Thermal modeling of multi-gate field effect transistors based on a reduced order model
590
Thermal modeling of nanodevices
591
Thermal modeling of novel monolithic pyroelectric infrared image sensors
592
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
593
Thermal Modeling of Organic Light-Emitting Diode Display Panels
594
Thermal modeling of passive thermal management system with phase change material for LiFePO4 battery
595
Thermal modeling of permanent magnet double-rotor machine
596
Thermal modeling of permanent magnet motor with finite element method
597
Thermal modeling of portable power cables
598
Thermal Modeling Of Portable Power Cables
599
Thermal modeling of pot core magnetic components used in high frequency static converters
600
Thermal modeling of power gallium arsenide microwave integrated circuits
601
Thermal modeling of power substations using the finite element method
602
Thermal modeling of pulse current trimming
603
Thermal modeling of PV modules using computational simulation
604
Thermal Modeling of Quilt Packaging Interconnects
605
Thermal Modeling of Resistive Switching Devices
606
Thermal modeling of self-heating in strained-silicon MOSFETs
607
Thermal modeling of silicon-on-insulator current mirrors
608
Thermal modeling of specialty heat-sinks for low-cost COP packaging of high-power LEDs
609
Thermal Modeling of Terahertz Quantum-Cascade Lasers: Comparison of Optical Waveguides
610
Thermal modeling of the module integrated DC-DC converter for flexible thin-film PV modules
611
Thermal modeling of the module integrated DC-DC converter for thin-film PV modules
612
Thermal modeling of thin-film SOI transistors
613
Thermal modeling of three-dimensional integrated circuits considering the thermal removal capability of different TSVs
614
Thermal modeling of through hole capacitors
615
Thermal modeling of transferred VCSELs
616
Thermal modeling of WLP-BAW filters: Power handling and miniaturization
617
Thermal modeling techniques for heat sinks for power electronics
618
Thermal modeling with PC spreadsheets
619
Thermal modeling, analysis and control using an electrical analogy
620
Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods
621
Thermal modeling, analysis, and management of high-power GaN transistors
622
Thermal Modeling, Characterization and Management of On-Chip Networks
623
Thermal modeling, measurements and design considerations of GaAs microwave devices
624
Thermal modelling and analysis for offshore submarine high-voltage direct current cable crossings
625
Thermal modelling and control of hydrogen-oxygen combustor
626
Thermal modelling and optimisation of hot solder dip process
627
Thermal modelling and optimization-based control of a batch diffusion furnace
628
Thermal modelling and performance assessment of PV modules based on climatic parameters
629
Thermal modelling and selection of a high speed permanent magnet surface mount electrical machine
630
Thermal modelling and simulation of non-volatile and non-rotating phase change memory cell
631
Thermal modelling approach and model predictive control of a water-cooled PEM fuel cell system
632
Thermal modelling for dynamic transformer rating in low carbon distribution network operation
633
Thermal modelling for temperature control in MPSoC´s using Timed Continuous Petri Nets
634
Thermal modelling investigation of heat paths due to iron losses in synchronous machines
635
Thermal modelling of 3D multicore systems in a flip-chip package
636
Thermal modelling of a claw-pole car alternator: Steady-state computation and identification of free convection coefficients
637
Thermal modelling of a fractional-slot concentrated-winding Kaman type Axial-Flux Permanent-Magnet machine
638
Thermal modelling of a high speed permanent magnet synchronous machine
639
Thermal modelling of a kilovoltage X-ray source for portal imaging
640
Thermal modelling of a low speed air-cooled Axial Flux Permanent Magnet generator
641
Thermal modelling of a passively cooled inverter for wave power
642
Thermal modelling of a tubular linear machine for marine renewable generation
643
Thermal modelling of AC commutator motors for domestic appliances
644
Thermal modelling of an alternator for use in a prediction system
645
Thermal Modelling of an Induction Motor
646
Thermal modelling of cables in conduits: (air gap consideration)
647
Thermal modelling of coherent asymmetric dipole antenna arrays with variable antenna positions and orientations
648
Thermal modelling of electro-mechanical cables for ROV applications
649
Thermal modelling of electronic systems based on spectral analysis of circuit temperature response
650
Thermal Modelling Of Enclosed Cables In Automotive Applications
651
Thermal modelling of high power GTO thyristors
652
Thermal modelling of hot spot formation at deep level centers in silicon transistor under laser irradiation
653
Thermal modelling of IC packages
654
Thermal Modelling of IGBT Devices
655
Thermal modelling of infrared heater for plastic waste gasification
656
Thermal modelling of integrated heat exchangers with alternating ribs
657
Thermal modelling of large-format laminated Li-ion battery and experimental validation using embedded thermocouples
658
Thermal modelling of multifinger GaAs/GaN FETs using SPICE
659
Thermal modelling of multiple die packages
660
Thermal modelling of nonideal interstitial microwave antenna array hyperthermia for the treatment of cancer
661
Thermal modelling of permanent-split-capacitor single-phase induction motors based on accurate loss density measurement
662
Thermal modelling of solder joint formation
663
Thermal modelling of switched flux permanent magnet machines
664
Thermal Modelling of TEFC Alternators
665
Thermal modelling of the building and its HVAC system using Matlab/Simulink
666
Thermal modelling of the emerging multi-chip packages
667
Thermal modelling of the human eye exposed to laser radiation
668
Thermal modelling of the Pentium processor package
669
Thermal modelling of TPV systems
670
Thermal modelling of tubular linear machines using a hybrid analytical method
671
Thermal modelling of vertical-cavity surface-emitting lasers using the finite-element method
672
Thermal modelling of water-cooled Axial-Flux Permanent Magnet Machine
673
Thermal modelling to analyze the effect of cell temperature on PV modules energy efficiency
674
Thermal modelling with neural network applied to Planck space mission
675
Thermal modelling, simulation and evaluation of a high power battery cell for automotive applications
676
Thermal models and electrical machine performance improvement using encapsulation material
677
Thermal models characterization for reliable temperature capping and performance optimization in Multiprocessor Systems on Chip
678
Thermal models for dynamic clock control
679
Thermal Models for Online Detection of Pulp Obstructing the Cooling System of TEFC Induction Motors in Pulp Area
680
Thermal models for on-line detection of pulp obstructing the cooling system of TEFC induction motors in pulp area
681
Thermal Models for Optical Circuit Simulation Using a Finite Cloud Method and Model Reduction Techniques
682
Thermal models for semiconductor device simulation
683
Thermal models for semiconductors
684
Thermal models generator (TMG)
685
Thermal models of short arc between high current contacts
686
Thermal modifications of internal quantum efficiencies in the near IR [Si solar cells]
687
Thermal modulation effect on the heat change and flow during crystal growth in a vertical Bridgman cavity
688
Thermal monitoring - from inside the cabinet
689
Thermal monitoring and testing of electronic systems
690
Thermal Monitoring of Eyjafjöll Volcano Eruptions by Means of Infrared MODIS Data
691
Thermal monitoring of large power transformers
692
Thermal Monitoring of Major Active Volcanoes Worldwide by Synergetic Merge of High- and Lowresolution Payloads ASTER, ETM+, TM and MODIS
693
Thermal monitoring of memories
694
Thermal monitoring of real processors: Techniques for sensor allocation and full characterization
695
Thermal monitoring of safety-critical integrated systems
696
Thermal monitoring of the myocardium under blood arrest preliminary study
697
Thermal monitoring of transformers
698
Thermal monitoring on power transformers
699
Thermal Monitoring: Raman Spectrometer System for Remote Measurement of Cellular Temperature on a Microscopic Scale
700
Thermal moon probe cable
701
Thermal multielement receiver optical radiation
702
Thermal nanoimprint fabrication of chalcogenide glass waveguide resonators
703
Thermal nanoimprint fabrication of chalcogenide glass waveguide resonators on nonconventional plastic substrates
704
Thermal nanoimprint fabrication of silicon high Q optical microdisk resonators
705
Thermal Nature Of Microwave Evoked Body Movements
706
Thermal near-field optical spectroscopy
707
Thermal network analysis in MV GIS design
708
Thermal network analysis in MV GIS design
709
Thermal network component models for 10 kV SiC power module packages
710
Thermal Network Model of Supercapacitors Stack
711
Thermal Networks for Time-Variant Cooling Systems: Modeling Approach and Accuracy Requirements for Lifetime Prediction
712
Thermal networks from heat wave equation
713
Thermal networks from phonon Boltzmann´s transport equation: Part I - Fundamentals
714
Thermal networks from phonon Boltzmann´s transport equation: Part II - Compact modeling
715
Thermal neutron backscatter imaging
716
Thermal Neutron Damage in Bipolar PNP Transistors
717
Thermal neutron detection using alkali halide scintillators with 6Li and pulse shape discrimination
718
Thermal neutron detection using Si detector and a boron implanted polyethylene converter
719
Thermal neutron detection with 6Li converters
720
Thermal neutron detection with a high-pressure Xe/TMA//sup 3/He gas electron multiplier
721
Thermal neutron detection with the lithium borate scintillator
722
Thermal neutron detection with the lithium borate scintillator
723
Thermal neutron detectors with discrete anode pad readout
724
Thermal Neutron Die-Away Studies in a 14 MeV Neutron-Based Active Interrogation System
725
Thermal neutron filter design for the neutron radiography facility at the LVR-15 reactor
726
Thermal neutron imaging tests using Ce doped LiCaAlF6 and sealed 252Cf source
727
Thermal neutron imaging tests with rare-earthion-doped LiCaAlF6 and sealed 252Cf source
728
Thermal neutron imaging with a Rotationally Modulated Collimator (RMC)
729
Thermal neutron imaging with PIN photodiode line scanner and Eu-doped LiCaAlF6 scintillator
730
Thermal Neutron Scintillator Detectors Based on Poly (2-Vinylnaphthalene) Composite Films
731
Thermal neutron soft error rate for SRAMS in the 90NM–45NM technology range
732
Thermal neutron source location using a 3-D position-sensitive CdZnTe detector array
733
Thermal Neutron-Induced Soft Errors in Advanced Memory and Logic Devices
734
Thermal Nitridation of Chemical Dielectrics as an Easy Approach to Ultra-thin Gate Oxide Processing
735
Thermal nitridation of Si and SiO2for VLSI
736
Thermal Nitridation of Si and SiO2 for VLSI
737
Thermal Nitride capacitors for high density RAMs
738
Thermal nitride gate FET technology for VLSI devices
739
Thermal Noise Analysis in Conical-Scan Radars
740
Thermal Noise Analysis of a Programmable-Gain Switched-Capacitor Amplifier With Input Offset Cancellation
741
Thermal noise analysis of multi-bit SC gain-stages for low-voltage high-resolution pipeline ADC design
742
Thermal noise analysis of multi-input SC-integrators for delta-sigma modulator design
743
Thermal noise analysis of SGMOSFET for different substrate and gate oxides
744
Thermal Noise Analysis on the Resistive Vee Dipole Antenna for Ground-Penetrating Radar Applications
745
Thermal noise and bit error rate limits in nanoscale memories
746
Thermal noise and drift mobility of randomly moving electrons in homogeneous materials with highly degenerate electron gas
747
Thermal Noise and Noise Measurements—A 2010 Update
748
Thermal noise and radiation pressure in MEMS Fabry-Perot tunable filters and lasers
749
Thermal noise behavior of a nonlinear bridge circuit
750
Thermal noise behavior of a thick depletion region avalanche photodetector
751
Thermal Noise Compliant Synthesis of Linear Lumped Macromodels
752
Thermal noise driven heat engines: Noise put to work, while it sheds light on “quantum heat engine weirdness”
753
Thermal Noise Effect in FTTH Communication Systems
754
Thermal noise emission of a lossy material for a TEM propagation
755
Thermal Noise Errors in DF Monopulse Systems Having Log Amplifiers
756
Thermal Noise from a Passive Linear Multiport
757
Thermal noise from long sense lines
758
Thermal noise from switches in a switched-capacitor gain stage
759
Thermal noise in a finite bandwidth
760
Thermal Noise in Amplitude Comparison Monopulse Systems
761
Thermal noise in buried-channel MOSFET
762
Thermal noise in digital Josephson devices
763
Thermal noise in double-injection space-charge-limited solid-state diodes
764
Thermal noise in field-effect devices
765
Thermal Noise in Field-Effect Transistors
766
Thermal noise in field-effect transistors
767
Thermal noise in field-effect transistors
768
Thermal noise in gradual-junction-gate f.e.t.
769
Thermal noise in Hall-effect twoports
770
Thermal Noise in Interferometric Gravitional-Wave Detectors
771
Thermal noise in junction-gate field-effect transistors
772
Thermal noise in linear damped systems
773
Thermal noise in lossy waveguides
774
Thermal Noise in MOSFETs: A Two- or a Three-Parameter Noise Model?
775
Thermal noise in multi-section radio links
776
Thermal noise in nonlinear resistive devices and its circuit representation
777
Thermal noise in optical fibers and its influence on long-distance coherent communication systems
778
Thermal noise in optical reference resonators
779
Thermal Noise in Spin-Phonon Systems
780
Thermal noise in the hot electron regime in FET´s
781
Thermal Noise in Track-and-Hold Circuits: Analysis and Simulation Techniques
782
Thermal noise limits in nanoscale electronics
783
Thermal noise limits of microphones
784
Thermal noise measurement of SI integrator
785
Thermal noise measurements in GaAs MESFET´s
786
Thermal noise measurements on micro-cantilevers coated with dielectric materials
787
Thermal noise modeling for short-channel MOSFETs
788
Thermal noise modeling for short-channel MOSFETs
789
Thermal noise modeling of nano-scale MOSFETs for mixed-signal and RF applications
790
Thermal noise of microwave antennas
791
Thermal noise of microwave superconducting filter-amplifier combinations
792
Thermal noise of silicon based grating reflectors for high-precision metrology
793
Thermal noise of transmission lines: A generalized solution
794
Thermal Noise of Transmission Media
795
Thermal noise performance in recent CMOS technologies
796
Thermal noise random number generator based on SHA-2 (512)
797
Thermal noise response based control of tip-sample separation in AFM
798
Thermal noise, damping fundamentals and mode analysis: application to GMR sensors
799
Thermal noise, intermittent failures, and yield in Josephson circuits
800
Thermal noise, motional electromotive force, and electric fields in the human body
801
Thermal noise, suspensions and new materials
802
Thermal Noise-Limited Fiber-Optic Sensing at Infrasonic Frequencies
803
Thermal nondestructive examination method for thermal sprayed coatings
804
Thermal nondestructive testing technology of aircraft composite material
805
Thermal Nonequilibrium of a Free-Burning Argon Arc Plasma
806
Thermal Nonequilibrium Simulation of an Arc Plasma Jet
807
Thermal Nonlinearities in Contour Mode AlN Resonators
808
Thermal nonlinearity analysis of toroidal microcavities
809
Thermal nonlinearity and optical bistability in a graphene-silicon waveguide resonator
810
Thermal nonlinearity in coupled disk microresonators
811
Thermal nonuniformities and mechanism of Brownian motion
812
Thermal Numerical Simulation and Correlation for a Power Package
813
Thermal numerical simulation for advanced package development
814
Thermal optical bistability in InGaAs/InAlAs MQW etalons at 1.5 mu m wavelength
815
Thermal optical property analysis of three mirrors aberration optical system
816
Thermal Optimal Design for Plain Plate-Fin Heat Sinks by Using Neuro-Genetic Method
817
Thermal optimalization of a stereovision electronic travel aid for the blind
818
Thermal optimisation of GaN flip chip power transistors
819
Thermal optimisation of mechatronically integrated power electronics for an engine cooling fan using brushless technology
820
Thermal optimised modulation methods of three-level neutral-point-clamped inverter for 10 MW wind turbines under low-voltage ride through
821
Thermal optimization design of high-power LED fin-tubular radiator
822
Thermal Optimization for a HSPMG Used for Distributed Generation Systems
823
Thermal optimization for micro-architectures through selective block replication
824
Thermal optimization formulation strategies for multi-constraints electronic devices placement on PCB
825
Thermal optimization in a power electronic supply
826
Thermal optimization in multi-granularity multi-core floorplanning
827
Thermal optimization of 3D microcontacts using DOE and CFD analysis
828
Thermal optimization of a flip-chip WiFi RF front-end IC
829
Thermal Optimization of a High-Power Salient-Pole Electrical Machine
830
Thermal Optimization of a High-Speed Permanent Magnet Motor
831
Thermal optimization of a miniaturized camera with Pentium PC module
832
Thermal Optimization of a Radial Folded Fin Heat Sink for Desktop Computer Applications
833
Thermal optimization of a tubular permanent magnet linear synchronous motor
834
Thermal optimization of an air-cooling heat exchanger utilizing manifold-microchannels
835
Thermal optimization of an integrated LV battery energy storage station
836
Thermal Optimization of Circular Bodies Submitted to an Intense Heat Flux by Constructal Design
837
Thermal Optimization of Electronic Equipment: Form Factor Improvement
838
Thermal optimization of electronic systems using Design of Experiments based on numerical inputs
839
Thermal optimization of high power LED arrays with a fin cooling system
840
Thermal optimization of metalized polypropylene film capacitors
841
Thermal optimum analyses and mechanical design of 10-kA, vapor-cooled power leads for SSC superconducting magnet tests at MTL
842
Thermal Overload Protection of Induction Motors Under Waveform Distortion
843
Thermal Overload Tests on a 400 MVA Power Transformer with a Special 2.5 P.U. Short-Time Loading Capability
844
Thermal overload tests on a 400-MVA power transformer with a special 2.5-p.u. Short time loading capability
845
Thermal Overshoot Analysis for Hot-spot Temperature Rise of Transformer
846
Thermal oxidation and characterization for surface layers of Al implanted TiN films
847
Thermal oxidation and stability of thin manganese films
848
Thermal oxidation as a key technology for high efficiency screen printed industrial silicon solar cells
849
Thermal Oxidation Kinetics and Locos Isolation in Soi Materials
850
Thermal oxidation of 6H-silicon carbide at enhanced growth rates
851
Thermal oxidation of AlGaAs: modeling and process control
852
Thermal oxidation of CuInSe2: experiment and physico-chemical model
853
Thermal Oxidation of Lightly- and Heavily-Doped Silicon in Pure N2O
854
Thermal oxidation of silicon as an impurity-controlled process
855
Thermal oxidation of ultra thin palladium (Pd) foils at room conditions
856
Thermal oxidation studies on methyl grafted natural rubber polymer electrolytes with paraphenylene diamine additive
857
Thermal oxidation-induced strain in silicon nanobeams
858
Thermal Oxide Film Deposition Monitoring Algorithm
859
Thermal oxide, Al2O3 and amorphous-Si passivation layers on silicon
860
Thermal packaging - the moving frontier
861
Thermal Packaging Challenges and Opportunities at the Micro and Nano Scales
862
Thermal Packaging of High Temperature Superconductor Bulk for Superconducting Flywheel Energy Storage
863
Thermal parameter estimation in the presence of uncertainty [packaging]
864
Thermal parameter estimation using recursive identification
865
Thermal parameter estimation using recursive identification
866
Thermal parameter extraction for bipolar circuit modelling
867
Thermal Parameter Extraction Method for Light-Emitting Diode (LED) Systems
868
Thermal parameter extraction technique using DC I-V data for HBT transistors
869
Thermal parameter identification of photovoltaic module using genetic algorithm
870
Thermal parameter identification of simplified building model with electric appliance
871
Thermal parameters measurement method of electronics materials
872
Thermal parameters measurement on fire fighter during intense fire exposition
873
Thermal parameters measurement on fire fighter: Improvement of the monitoring system
874
Thermal Parametric Imaging in the Evaluation of Skin Burn Depth
875
Thermal passive systems, latent heat storage and simulation
876
Thermal path following robot vehicle: Sensor design and motion control
877
Thermal Pathfinding for 3-D ICs
878
Thermal Performance Analysis for Packaging Configuration Design of Multifinger GaInP Collector-Up HBTs as Small High-Power Amplifiers
879
Thermal performance analysis for the machine tool´s spindle
880
Thermal performance analysis of a 3D package
881
Thermal performance analysis of a novel compound parabolic concentrator solar collector
882
Thermal Performance Analysis of a Silicon Microreactor for Rapid DNA Analysis
883
Thermal performance analysis of cryogenic system for cooling of superconducting magnets at 4K temperature level
884
Thermal performance analysis of linear fresnel reflector concentrator with a compound parabolic cavity absorber
885
Thermal performance analysis of photoelectric parameters on high-power LEDs packaging modules
886
Thermal performance analysis of polymer optical waveguides for thermo-optic applications
887
Thermal performance analysis of solar steam aided coal-fired power generation
888
Thermal performance analysis of the double-sided linear switched reluctance motor
889
Thermal Performance Analysis of the Lithium-Ion Batteries
890
Thermal performance and mechanical stress analysis of BGA and flex-CSP using parametric FEA models
891
Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packages
892
Thermal performance and placement design of LED array package on PCB
893
Thermal Performance and Reliability Analysis of Single-Phase PV Inverters With Reactive Power Injection Outside Feed-In Operating Hours
894
Thermal performance and reliability aspects of silicon hybrid multi-chip modules
895
Thermal performance and reliability assessment of nano-sintered silver die attach materials
896
Thermal performance and reliability characterization of bonded interface materials (BIMs)
897
Thermal performance and reliability management for novel power electronic packaging using integrated base plate
898
Thermal Performance and Reliability of Thermal Interface Materials: A Review
899
Thermal performance and solder joint reliability for board level assembly of modified leadframe package
900
Thermal Performance Assessment and Validation of High-Concentration Photovoltaic Solar Cell Module
901
Thermal performance assessment in AlGaN/GaN structures by microsensor integration
902
Thermal performance challenges for rapid thermal processing
903
Thermal performance characteristic comparison between flip-chip wirebond ceramic multichip modules
904
Thermal performance characteristics of folded stacked packages
905
Thermal performance characterization of nano thermal interface materials after power cycling
906
Thermal Performance Comparison between Various RF Transceiver Modules
907
Thermal performance comparison of chip-on-board, flip chip-on-board and standard TQFP package
908
Thermal performance comparison of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages
909
Thermal performance comparison of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages
910
Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules
911
Thermal Performance Correlation of Horizontal Closed-Loop Oscillating Heat Pipes
912
Thermal performance enhancement by exploitation of nano-effects
913
Thermal Performance Enhancement for CSP Packages
914
Thermal performance enhancement in solar air heater channel with periodically V-shaped baffles
915
Thermal performance evaluation and methodology for pyramid stack die packages
916
Thermal performance evaluation for a microelectronics motor control system incorporating dynamic heat sources
917
Thermal Performance Evaluation of a High-Speed Flywheel Energy Storage System
918
Thermal performance evaluation of a synthetic jet heat sink for electronic cooling
919
Thermal performance evaluation of an insulation system for cast resin power transformers
920
Thermal performance evaluation of Power QFN package with stacked and side by side die configuration
921
Thermal Performance Evaluation of Power SSL Module in LTCC
922
Thermal performance evaluation of SiC power devices packaging
923
Thermal performance evaluation of various heat sinks for air cooling
924
Thermal performance evaluation of VLSI packaging
925
Thermal performance evaluations of passive solar building in Korea
926
Thermal Performance Experiment Research of One New Floor Heating System
927
Thermal performance improvement of solar thermal power generation
928
Thermal performance improving for small form factor BGA
929
Thermal performance investigation of DQW GaInNAs laser diodes
930
Thermal performance investigation of three-dimensional structure unit in double-sided cooling IGBT module
931
Thermal performance limits of polymer composite pin fin heat sinks
932
Thermal performance limits of the QFP family
933
Thermal performance limits of the QFP family
934
Thermal performance measurement for confined heat sinks
935
Thermal performance modeling of hybrid liquid-air cooled servers
936
Thermal performance modeling of power cable joints
937
Thermal performance of 1.55μm InGaAlAs quantum well buried heterostructure lasers
938
Thermal performance of 3D ICs: Analysis and alternatives
939
Thermal performance of a Direct-Bond-Copper Aluminum Nitride manifold-microchannel cooler
940
Thermal performance of a double-action pulsed jet CPU cooler
941
Thermal performance of a dual 1.2 kV, 400 a silicon-carbide MOSFET power module
942
Thermal performance of a hybrid photovoltaic-thermal collector with a modified absorber
943
Thermal performance of a plate-fin heat sink with a shield
944
Thermal performance of a power electronics module made by thick-film planar interconnection of power devices
945
Thermal performance of a solder-coated optical fiber Bragg grating sensor
946
Thermal performance of a thermoelectric air-cooling system with heat sinks
947
Thermal performance of a thin high interconnect density organic substrate for flip-chip applications
948
Thermal Performance of a Three-Phase Induction Motor Under Fault Tolerant Operating Strategies
949
Thermal Performance of a Three-Phase Induction Motor Under Fault Tolerant Operating Strategies
950
Thermal Performance of a Vapor Chamber Heat Pipe with Diamond-Copper Composition Wick Structures
951
Thermal performance of air-cooled hybrid heat sinks for a low velocity environment
952
Thermal performance of aluminum-foam heat sinks by forced air cooling
953
Thermal performance of an air-cooled plastic ball grid array package in natural and forced convection
954
Thermal performance of an elliptical pin fin heat sink
955
Thermal performance of an integral immersion cooled multichip module package
956
Thermal performance of an integral immersion cooled multichip module package
957
Thermal performance of an MCM flip-chip assembly in liquid nitrogen
958
Thermal Performance of an Open-Slot Modular-Wound Machine With External Rotor
959
Thermal performance of baseplate and direct substrate cooled power modules
960
Thermal performance of box-type solar cooker with inbuilt paraboloid reflector
961
Thermal performance of building attached sunspace in Jordan climate
962
Thermal Performance of Carbon Nanotube-Based Composites Investigated by Molecular Dynamics Simulation
963
Thermal performance of CMOS-SOI transistors from weak to strong inversion
964
Thermal performance of collector-up HBTs for small high-power amplifiers with a novel thermal via structure underneath the HBT fingers
965
Thermal performance of cooling system for red, green and blue LED light source for rear projection TV
966
Thermal Performance of Data Centers-Rack Level Analysis
967
Thermal Performance of Direct Buried Pipe-Type Cable Splices
968
Thermal Performance of Direct Buried Pipe-Type Cable Splices
969
Thermal Performance of Distribution Transformers in Underground Vaults: I - The Problem
970
Thermal Performance of Distribution Transformers in Underground Vaults: II - Mathematical Model
971
Thermal performance of double-sided SMT capacitors: Operation and soldering
972
Thermal performance of dual piezoelectric cool jet for ultra-thin mobile applications
973
Thermal performance of embedded active chips
974
Thermal performance of embedded heat pipe in high power density LED streetlight module
975
Thermal performance of FCMBGA: Exposed molded die compared to lidded package
976
Thermal performance of ferrule designs for medium voltage cable jointing
977
Thermal performance of flip chip ball grid array packages
978
Thermal performance of flip chip using finite element method
979
Thermal performance of heatsink and thermoelectric cooler packaging designs in LED
980
Thermal performance of high power LED package based on LTCC
981
Thermal performance of horizontal closed-loop ground-coupled heat pump systems using flowable-fill
982
Thermal performance of IMS™ dielectrics: data and prediction
983
Thermal performance of Inkjet-assisted spray cooling in a closed system
984
Thermal performance of Landsat-7 ETM+ instrument during first year in flight
985
Thermal performance of LED packages for solid state lighting with novel cooling solutions
986
Thermal performance of metal-clad fiber Bragg grating sensors
987
Thermal performance of metamorphic double heterojunction bipolar transistors with InP and InAlP buffer layers
988
Thermal Performance of Microchannels With Wavy Walls for Electronics Cooling
989
Thermal performance of microchannels with wavy walls for electronics cooling
990
Thermal performance of miniature loop heat pipe operating under different heating modes
991
Thermal performance of multiple piezoelectric-magnetic fans
992
Thermal performance of naturally ventilated test building with pitch and ceiling insulation
993
Thermal performance of non-metallic two-phase cold plates for humanoid robot cooling
994
Thermal performance of novel thin heat pipe
995
Thermal performance of oxide-free lithographic VCSELs
996
Thermal performance of packed bed solar air heater
997
Thermal performance of PCM-cooled mobile phone
998
Thermal performance of photonic crystal waveguiding devices based on GaInNAs/GaInAs quantum-wells
999
Thermal performance of plastic-encapsulated and hermetically sealed components for automotive applications
1000
Thermal performance of power packages-single-inline package as a case study